IC Substrates

IC Substrates inspection solutions

IC Substrates: 5 - 15 micron line/space

Bare Board Inspection

CIMS Phoenix R2R Maxima

Phoenix Nano

Phoenix Nano is designed to support high volume manufacturing of of IC Substrates. It is capable to scan down to 5 µm line/space width technology.

Phoenix Micro

Phoenix Micro is designed to support high volume manufacturing of of IC Substrates. It is capable to scan down to 7 µm line/space width technology.

Phoenix Maxima

Phoenix Maxima is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width technology.


Verification Systems

CIMS CVR-100 IC

CVR 100 IC

CVR 100 IC, CIMS verification station, is designed to support high volume manufacturing of IC Substrates. It is optimized for verification of 5 ~ 25 µm line/space width technology.

CVR 100 FL

CVR 100 FL, CIMS verification station, is designed to support high volume manufacturing of HDI and IC Substrates. It is optimized for verification of 10 ~ 30 µm line/space width technology.


Photo-tools inspection

CIMS Phoenix PT

Phoenix PT/Micro

Phoenix PT/Micro, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 7 µm line/space width technology.

Phoenix PT+

Phoenix PT+, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 15 µm line/space width technology.

Flex, Rigid Flex, R2R: 5 - 15 micron line/space

 

Flex and Rigid-Flex PCB Inspection

CIMS Flex Inspection

Phoenix FLEX/Maxima

Phoenix FLEX/Maxima is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 10 µm line/space width technology.

Phoenix FLEX/Extra

Phoenix FLEX/Extra is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.


R2R (Roll-to-Roll) PCB Inspection

CIMS R2RInspection

Phoenix R2R/Maxima

Phoenix R2R/Maxima is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 10 µm line/space width technology.

Phoenix R2R/Extra

Phoenix R2R/Extra is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.

IC Substrates (strips): 5 - 10 micron line/space

IC Substrates Strips Inspection

CIMS Unicorn 1200

Unicorn 1200/Turbo

Unicorn 1200/Turbo CIMS AVI system is designed for final inspection of ultra fine line IC Substrates. It is capable to scan down to 5 µm line/space width technology.

Unicorn 900/Turbo

Unicorn 900/Turbo CIMS AVI system is designed for final inspection of fine line IC Substrates. It is capable to scan down to 8 µm line/space width technology.


Verification Systems

CIMS PVS 1200

PVS 1200

PVS 1200, CIMS AVI verification station, is designed for verification of IC Substrates strips scanned with AVI systems. It is optimized for verification of 5 ~ 8 µm line/fingers width technology.

PVS 900

PVS 900, CIMS AVI verification station, is designed for verification of IC Substrates strips scanned with AVI systems. It is optimized for verification of 8 ~ 12 µm line/fingers width technology.

IC Substrates (strips): 10 - 15 micron line/space

 

IC Substrates Strips Inspection

CIMS Unicorn 300

Unicorn 600/Turbo

Unicorn 600/Turbo CIMS AVI system, is designed for final inspection of advanced IC Substrates. It is capable to scan down to 10 µm line/space width technology.

Unicorn 300/Turbo

Unicorn 300/Turbo CIMS AVI system is designed for final inspection of mainstream IC Substrates. It is capable to scan down to 15 µm line/space width technology.


Verification Systems

CIMS PVS 600

PVS 800

PVS 800, CIMS AVI verification station, is designed for verification of IC Substrates strips scanned with AVI systems. It is optimized for verification of 10 ~ 18 µm line/fingers width technology.

PVS 200

PVS 200, CIMS AVI verification station, is designed for verification of IC Substrates strips scanned with AVI systems. It is optimized for verification of 15 ~ 25 µm line/fingers width technology.

IC Substrates (panels): 7 - 25 micron line/space

 

IC Substrates Panel Inspection

CIMS Phoenix Fi

Phoenix Fi/ICS

Phoenix Fi/ICS is designed to support final inspection of IC Substrates and ultra fine line HDI. It is capable to scan down to 7 µm line/space width technology.


Verification Systems

CIMS CVR 100 FI

CVR 100 Fi

CVR 100 Fi, CIMS verification station, is designed for verification of finished boards of high-end HDI and IC Substrates. It is optimized for verification of 10 ~ 30 µm line/space width technology.

Special Applications

 

Laser Via Inspection

CIMS Laser Via Inspection

Phoenix LV

Phoenix LV is designed to support inspection of laser via in high volume manufacturing of HDI or IC Substrates. It is capable to scan via holes down to 30 µm in diameter.

Phoenix LV+

Phoenix LV+ is designed to support inspection of laser via in high volume manufacturing of advanced HDI or IC Substrates. It is capable to scan via holes down to 15 µm in diameter.


Mechanical Drill Inspection

CIMS mechanical drill inspection

Phoenix MDI

Phoenix MDI is designed for inspection of mechanical (through) drills and slots on HDI and multi-layer PCB. It is capable to scan mechanical drills down to 150 µm in diameter.


IC Substrates Panel Inspection

CIMS Phoenix Fi

Phoenix Fi/ICS

Phoenix Fi/ICS is designed to support final inspection of IC Substrates and ultra fine line HDI. It is capable to scan down to 7 µm line/space width technology.

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