IC Substrates
IC Substrates inspection solutions
IC Substrates: 4 - 15 micron line/space
Bare Board Inspection
Phoenix Ultima
Phoenix Ultima is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 4 µm line/space width technology.
Phoenix Nano
Phoenix Nano is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 5 µm line/space width technology.
Phoenix Micro
Phoenix Micro is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width technology.
Phoenix Maxima
Phoenix Maxima is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width technology.
Verification Systems
CVR 100 IC
CVR 100 IC, CIMS verification station, is designed to support high volume manufacturing of IC Substrates. It is optimized for verification of 5 ~ 25 µm line/space width technology.
CVR 100 FL
CVR 100 FL, CIMS verification station, is designed to support high volume manufacturing of HDI and IC Substrates. It is optimized for verification of 10 ~ 30 µm line/space width technology.
Hybrid Verification Systems
VVR ICS
VVR ICS, CIMS verification station that combines virtual and physical verification within a single workstation. It is optimized for verification of 4 ~ 25 µm line/space width technology.
Photo-tools inspection
Phoenix PT/Micro
Phoenix PT/Micro, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 7 µm line/space width technology.
Phoenix PT+
Phoenix PT+, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 12.5 µm line/space width technology.
Flex, Rigid Flex, R2R: 5 - 15 micron line/space
Flex and Rigid-Flex PCB Inspection
Phoenix FLEX/Maxima
Phoenix FLEX/Maxima is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 10 µm line/space width technology.
Phoenix FLEX/Extra
Phoenix FLEX/Extra is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.
R2R (Roll-to-Roll) PCB Inspection
Phoenix R2R/Maxima
Phoenix R2R/Maxima is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 10 µm line/space width technology.
Phoenix R2R/Extra
Phoenix R2R/Extra is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.
IC Substrates (strips): 5 - 10 micron line/space
IC Substrates Strips Inspection
Unicorn 1200/Turbo
Unicorn 1200/Turbo CIMS AVI system is designed for final inspection of ultra fine line IC Substrates. It is capable to scan down to 5 µm line/space width technology.
Unicorn 900/Turbo
Unicorn 900/Turbo CIMS AVI system is designed for final inspection of fine line IC Substrates. It is capable to scan down to 8 µm line/space width technology.
Verification Systems
PVS 1200
PVS 1200, CIMS AVI verification station, is designed for verification of IC Substrates strips scanned with AVI systems. It is optimized for verification of 5 ~ 8 µm line/fingers width technology.
PVS 900
PVS 900, CIMS AVI verification station, is designed for verification of IC Substrates strips scanned with AVI systems. It is optimized for verification of 8 ~ 12 µm line/fingers width technology.
IC Substrates (strips): 10 - 15 micron line/space
IC Substrates Strips Inspection
Unicorn 600/Turbo
Unicorn 600/Turbo CIMS AVI system, is designed for final inspection of advanced IC Substrates. It is capable to scan down to 10 µm line/space width technology.
Unicorn 300/Turbo
Unicorn 300/Turbo CIMS AVI system is designed for final inspection of mainstream IC Substrates. It is capable to scan down to 15 µm line/space width technology.
Verification Systems
PVS 800
PVS 800, CIMS AVI verification station, is designed for verification of IC Substrates strips scanned with AVI systems. It is optimized for verification of 10 ~ 18 µm line/fingers width technology.
PVS 200
PVS 200, CIMS AVI verification station, is designed for verification of IC Substrates strips scanned with AVI systems. It is optimized for verification of 15 ~ 25 µm line/fingers width technology.
IC Substrates (panels): 7 - 25 micron line/space
IC Substrates Panel Inspection
Phoenix Fi/ICS
Phoenix Fi/ICS is designed to support final inspection of IC Substrates and ultra fine line HDI. It is capable to scan down to 7 µm line/space width technology.
Verification Systems
CVR 100 Fi
CVR 100 Fi, CIMS verification station, is designed for verification of finished boards of high-end HDI and IC Substrates. It is optimized for verification of 10 ~ 30 µm line/space width technology.
Special Applications
Blind Laser Via Inspection
Phoenix LV series
Phoenix LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 15, 20, 25 and 30 μm.
Through Laser Via Inspection
Galaxy VIA series
Galaxy VIA series represent the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 20, 25 and 30 μm.
Mechanical Drill Inspection
Phoenix MDI
Phoenix MDI is designed for inspection of mechanical (through) drills and slots on HDI and multi-layer PCB. It is capable to scan mechanical drills down to 150 µm in diameter.
IC Substrates Panel Inspection
Phoenix Fi/ICS
Phoenix Fi/ICS is designed to support final inspection of IC Substrates and ultra fine line HDI. It is capable to scan down to 7 µm line/space width technology.