IC载板

IC载板检测解决方案

IC载板:5 - 15微米线宽/线距

 

光板检测

CIMS Phoenix R2R Maxima

Phoenix Nano

Phoenix Nano设计用于支持大量制造IC载板,检测线路的能力最细可达5 µm线宽/线距

Phoenix Micro

Phoenix Micro设计用于支持大量制造IC载板,检测线路的能力最细可达7 µm线宽/线距

Phoenix Maxima

Phoenix Maxima设计用于支持大量制造IC载板和超精细线路HDI,检测线路的能力最细可达10 µm线宽/线距


检修系统

CIMS CVR-100 IC

CVR 100 IC

CVR-100 IC, CIMS检修工作站设计用于支持大量制造IC载板,经过优化检修线路的能力最细可达5 ~ 25 µm线宽/线距

CVR 100 FL

CVR-100 FL, CIMS检修工作站设计用于支持大量制造HDI和IC载板,经过优化检修线路的能力最细可达10 ~ 30 µm线宽/线距


底片检测

CIMS Phoenix PT

Phoenix PT/Micro

Phoenix PT/Micro, CIMS底片AOI检测系统设计用于检测高分辨率胶片菲林和玻璃菲林,检测线路的能力最细可达7 µm线宽/线距

Phoenix PT+

Phoenix PT+, CIMS底片AOI检测系统设计用于检测高分辨率胶片菲林和玻璃菲林,检测线路的能力最细可达15 µm线宽/线距 width technology.

软板,软硬结合板,R2R:5 - 15微米线宽/线距

软板和软硬结合板检测

CIMS Flex Inspection

Phoenix FLEX/Maxima

Phoenix FLEX/Maxima设计用于支持大量制造精细线路软板和软硬结合板,检测线路的能力最细可达10 µm线宽/线距

Phoenix FLEX/Extra

Phoenix FLEX/Extra设计用于支持大量制造精细线路软板和软硬结合板,检测线路的能力最细可达15 µm线宽/线距


R2R(卷对卷)PCB检测

CIMS R2RInspection

Phoenix R2R/Maxima

Phoenix R2R/Maxima设计用于支持卷对卷(R2R)制造软板和软硬结合板,检测线路的能力最细可达10 µm线宽/线距

Phoenix R2R/Extra

Phoenix R2R/Extra设计用于支持卷对卷(R2R)制造软板和软硬结合板,检测线路的能力最细可达15 µm线宽/线距

IC载板(条):5 - 10微米线宽/线距

 

IC载板条检测

CIMS Unicorn 1200

Unicorn 1200

Unicorn 1200 CIMS AVI系统设计用于超精细线路IC载板成品外观检测,检测线路的能力最细可达5 µm线宽/线距

Unicorn 900 Turbo

Unicorn 900 Turbo CIMS AVI系统设计用于精细线路IC载板成品外观检测,检测线路的能力最细可达8 µm线宽/线距


检修系统

CIMS PVS 1200

PVS 1200

PVS 1200, CIMS AVI检修工作站设计用于检修AVI系统扫描的IC载板条,经过优化检修线路的能力最细可达5 ~ 8 µm线宽/指距

PVS 900

PVS 900, CIMS AVI检修工作站设计用于检修AVI系统扫描的IC载板条。 经过优化检修线路的能力最细可达8 ~ 12 µm线宽/指距

IC载板(条):10 - 15微米线宽/线距

 

IC载板条检测

CIMS Unicorn 300

Unicorn 600 Turbo

Unicorn 600 Turbo CIMS AVI系统设计用于高级IC载板成品外观检测,检测线路的能力最细可达10 µm线宽/线距

Unicorn 300

Unicorn 300 CIMS AVI系统设计用于主流IC载板成品外观检测,检测线路的能力最细可达15 µm线宽/线距


检修系统

CIMS PVS 600

PVS 800

PVS 800, CIMS AVI检修工作站设计用于检修AVI系统扫描的IC载板条,经过优化检修线路的能力最细可达10 ~ 18 µm线宽/指距

PVS 200

PVS 200, CIMS AVI检修工作站设计用于检修AVI系统扫描的IC载板条,经过优化检修线路的能力最细可达15 ~ 25 µm线宽/指距

IC载板(线路板):10 - 25微米线宽/线距

 

IC Substrates Panel Inspection

CIMS Phoenix Fi

Phoenix Fi

Phoenix Fi is designed to support final inspection of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width technology.


Verification Systems

CIMS CVR 100 FI

CVR 100 FI

CVR-100 FI, CIMS verification station, is designed for verification of finished boards of high-end HDI and IC Substrates. It is optimized for verification of 10 ~ 30 µm line/space width technology.

特殊应用

 

 

Laser Via Inspection

CIMS Laser Via Inspection

Phoenix LV

Phoenix LV is designed to support inspection of laser via in high volume manufacturing of HDI or IC Substrates. It is capable to scan via holes down to 30 µm in diameter.

Phoenix LV+

Phoenix LV+ is designed to support inspection of laser via in high volume manufacturing of advanced HDI or IC Substrates. It is capable to scan via holes down to 15 µm in diameter.


Mechanical Drill Inspection

CIMS mechanical drill inspection

Phoenix MDI

Phoenix MDI is designed for inspection of mechanical (through) drills and slots on HDI and multi-layer PCB. It is capable to scan mechanical drills down to 150 µm in diameter.


IC Substrates Panel Inspection

CIMS Phoenix Fi

Phoenix Fi/ICS

Phoenix Fi/ICS is designed to support final inspection of IC Substrates and ultra fine line HDI. It is capable to scan down to 7 µm line/space width technology.

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