Add-on inspection options and capabilities
2D metrology enable accurate two dimensional measurements of individual elements of a PCB circuit. CIMS offers two types of 2D metrology: +2CD and +2DM.
+2CD: real time micro-measurements of individual PCB elements, such as traces or pads, with up to ±3 micron accuracy (subject to surface condition).
+2DM: AOI integrated macro-measurements of an entire panel in order to determine any dimensions violation.
3D metrology enable accurate three dimensional measurements of individual elements of a PCB circuit. CIMS offers two types of 3D metrology: +3DH and +3DP.
+3DH: real time 3D-measurements of a height or depth of individual PCB elements achieving up to ±2 micron accuracy (subject to surface condition of a measured element).
+3DP: real time 3D profiling of individual PCB elements with up to ±1 micron accuracy (subject to surface condition of a measured element).
Laser drill scanning add-on
CIMS LDI is a laser drill inspection option designed for HDI PCB and IC Substrates. It is supplied as an add-on option suitable for all CIMS Phoenix family AOI models capable of inspecting laser drills of all sizes (subject to base system’s resolution).
AOI systems equipped with LDI are capable of scanning both pre- and post-plating laser vias as well as conformal masks. Each such application features its own dedicated user interface making a job setup intuitive and straight forward.
Final inspection add-on
Fi (Final Inspection) option allows inspecting of finished boards with CIMS AOI. It is supplied as an add-on option suitable for all CIMS Phoenix family AOI models extending their capabilities to final inspection.
Fi can reliably detect common defects on gold, copper and solder mask.
Systems equipped with Fi option feature a dedicated final inspection interface for parameters setup.
Defects classification and scrapped units mapping
CDB and CDBIC are data management systems integrated with CIMS equipment. They are designed for quality and process control of the entire PCB inspection production cycle while also serving as real time defects classification system.
CDBIC adds another layer of control by tracing individual defective units across multiple layers and processes. It also integrates AVI data into the data management process combining it with the inputs from AOI.
VVS consists of a server that pulls the images of defects from every CIMS AOI and then sends them to VVS stations for sorting and filtering. In VVS stations, those images are shown to operators who then quickly remove non-critical and non-functional calls while passing only images that are most likely to represent true defects directly to CIMS Verification & Repair stations (CVR).
As a result, subsequent visual verification of actual panels with CIMS CVR focuses mostly on marking and repairing of the real defects rather than skipping over non-critical and non-functional defects.