AOI
Automated Optical Inspection Systems (AOI)
IC Substrates: 4 - 15 micron line/space
Bare Board Inspection
Phoenix Ultima
Phoenix Ultima is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 4 µm line/space width technology.
Phoenix Nano
Phoenix Nano is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 5 µm line/space width technology.
Phoenix Micro
Phoenix Micro is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width technology.
Phoenix Maxima
Phoenix Maxima is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width technology.
Verification Systems
CVR 100 IC
CVR 100 IC, CIMS verification station, is designed to support high volume manufacturing of IC Substrates. It is optimized for verification of 5 ~ 25 µm line/space width technology.
CVR 100 FL
CVR 100 FL, CIMS verification station, is designed to support high volume manufacturing of HDI and IC Substrates. It is optimized for verification of 10 ~ 30 µm line/space width technology.
Hybrid Verification Systems
VVR ICS
VVR ICS, CIMS verification station that combines virtual and physical verification within a single workstation. It is optimized for verification of 4 ~ 25 µm line/space width technology.
Photo-tools inspection
Phoenix PT/Micro
Phoenix PT/Micro, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 7 µm line/space width technology.
Phoenix PT+
Phoenix PT+, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 12.5 µm line/space width technology.
HDI PCB: 15 - 30 micron line/space
Bare Board Inspection(Phoenix Family)
Phoenix Extra
Phoenix Extra is designed to support high volume manufacturing of advanced HDI PCB and fine line PCB. It is capable to scan down to 15 µm line/space width technology.
Phoenix Turbo
Phoenix Turbo is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan down to 25 µm line/space width technology.
Phoenix HDI
Phoenix HDI is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology.
Bare Board Inspection(Galaxy Family)
Galaxy 15μ
Galaxy 15μ is designed to support high volume manufacturing of advanced HDI PCB and fine line PCB. It is capable to scan down to 15 µm line/space width technology.
Galaxy 25μ
Galaxy 25μ is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan down to 25 µm line/space width technology.
Galaxy 30μ
Galaxy 30μ is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology.
Verification Systems
CVR 100 FL
CVR 100 FL, CIMS verification station, is designed to support high volume manufacturing of HDI and IC Substrates. It is optimized for verification of 10 ~ 30 µm line/space width technology
CVR 100
CVR 100, CIMS verification station, is designed to support high volume manufacturing of HDI and multi-layer PCB. It is optimized for verification of 25 ~ 100 µm line/space width technology.
Hybrid Verification Systems
VVR HDI
VVR HDI, CIMS verification station that combines virtual and physical verification within a single workstation. It is optimized for verification of 15 ~ 35 µm line/space width technology.
VVR
VVR, CIMS verification station that combines virtual and physical verification within a single workstation. It is optimized for verification of 25+ µm line/space width technology.
Photo-tools inspection
Phoenix PT+
Phoenix PT+, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 12.5 µm line/space width technology.
Phoenix PT
Phoenix PT, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 25 µm line/space width technology.
MLB PCB: 30 - 100 micron line/space
Bare Board Inspection
Phoenix HDI
Phoenix HDI is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology.
Nova 800
Nova 800 is designed to support high volume manufacturing of multi-layer PCB (mainstream MLB). It is optimized for 50+ µm line/space width technology.
Nova 600
Nova 600 is designed to support high volume manufacturing of multi-layer PCB (mainstream MLB). It is optimized for 75+ µm line/space width technology.
Verification Systems
CVR 100
CVR 100, CIMS verification station, is designed to support high volume manufacturing of HDI and multi-layer PCB. It is optimized for verification of 25 ~ 100 µm line/space width technology.
Hybrid Verification Systems
VVR
VVR, CIMS verification station that combines virtual and physical verification within a single workstation. It is optimized for verification of 25+ µm line/space width technology.
Photo-tools inspection
Phoenix PT
Phoenix PT, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 25 µm line/space width technology.
Flex, Rigid Flex, R2R: 5 - 15 micron line/space
Flex and Rigid-Flex PCB Inspection
Phoenix FLEX/Maxima
Phoenix FLEX/Maxima is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 10 µm line/space width technology.
Phoenix FLEX/Extra
Phoenix FLEX/Extra is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.
R2R (Roll-to-Roll) PCB Inspection
Phoenix R2R/Maxima
Phoenix R2R/Maxima is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 10 µm line/space width technology.
Phoenix R2R/Extra
Phoenix R2R/Extra is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.
Flex, Rigid Flex, R2R: 15 - 30 micron line/space
Flex and Rigid-Flex PCB Inspection
Phoenix FLEX/Turbo
Phoenix FLEX/Turbo is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm line/space width technology.
Phoenix FLEX/HDI
Phoenix FLEX/HDI is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width technology.
R2R (Roll-to-Roll) PCB Inspection
Phoenix R2R/Turbo
Phoenix R2R/Turbo is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm line/space width technology.
Phoenix R2R/HDI
Phoenix R2R/HDI is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width technology.
Special Applications
Blind Laser Via Inspection
Phoenix LV series
Phoenix LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 15, 20, 25 and 30 μm.
Galaxy LV series
Galaxy LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 15, 20 and 25 μm.
Through Laser Via Inspection
Galaxy VIA series
Galaxy VIA series represent the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 20, 25 and 30 μm.
Mechanical Drill Inspection
Phoenix MDI
Phoenix MDI is designed for inspection of mechanical (through) drills and slots on HDI and multi-layer PCB. It is capable to scan mechanical drills down to 150 µm in diameter.
Plugged Via Holes (PVH) Inspection
Galaxy PVH
Galaxy PVH is designed to inspect to plugged via holes that are typically filled with resin in high volume manufacturing of MLB and HDI PCB supporting inspection of PVH down to 75 µm in diameter.
Touch Screen Inspection
Phoenix Touch
Phoenix Touch is designed for inspection of conductors on touch screen panels. It is capable to scan down to 25 µm line/space width technology.
Large Panel Inspection
Phoenix LT
Phoenix LT is designed for inspection of large panel of up to 36″ x 42″ (914 mm x 1,067 mm). It is capable to scan down to 40 µm line/space width technology.