CIMS – Creativity in Motion

 

For the last 30 years, CIMS, the automated optical inspection leader, has been developing and selling AOI systems for all segments of PCB industry.

Our solutions integrate the most advanced optical, mechanical, electronic hardware and software components that have been designed and developed in our R&D centers in Israel and China.

 

Spark 2.0

Spark 2.0 is the second generation of CIMS inspection engine that powers our latest generation of automated optical inspection systems which combines both hardware and software modules. Some of the key features of Spark technology include the following:

  • Advanced image processing algorithms enable customized detection that ensures optimal performance for all combinations of PCB designs and surface conditions;
  • Multizone is the Spark’s way to analyze and group different parts of a circuit in order to independently optimize inspection performance for each zone element;
  • Multistep provides an additional level of inspection flexibility with independent settings for each PCB step;
  • Advanced false calls filtering mechanism filters out false calls by analyzing CAD data prior to the actual scanning thus dramatically reducing setup time on AOI;
  • DST (dual space threshold) is a special image processing method to increase AOI sensitivity for fine shorts while keeping false calls rate to an absolute minimum.

Microlight

Microlight is the illumination technology used with CIMS advanced AOI models such as Phoenix HDI, Turbo, Extra as well as with Nova AOI series. Microlight technology is characterized by the following features:

  • High performance multi-spectrum halogen light source ensures reliable image acquisition with of all types of materials and surface conditions;
  • High precision concave mirrors enable focusing light without the use of lenses and with minimal losses;
  • Accurate light paths adjustment ensures optimal illumination coverage of three dimensional shapes of the PCB surface;
  • Special composite filters designed to maximize contrast while scanning wide range of materials and surface treatments;
  • Flexible combination of diffusive and reflective light paths enable optimized performance for wide range of conditions;
  • Straight optic line enables image acquisition along the reflective light paths and the 90 degrees angle to the scanned surface;
  • Robust structure ensures reliable operation and easy maintenance.

Prisma

Prisma is the illumination technology used with CIMS high resolution AOI models primarily designed for IC Substrates inspection: Phoenix Nano, Micro and Maxima. Prisma technology combines the following features:

  • Extremely precise light path control using automated Fresnel optics;
  • High precision mechanical structure enables exceptional stability over long period of use;
  • High performance multi-spectrum halogen light source ensures reliable image acquisition with of all types of materials and surface conditions;
  • Ultra-high precision concave mirrors enable focusing light without the use of lenses and with minimal losses;
  • Micro-prisms for contrast enhancement;
  • Special composite filters designed to maximize contrast while scanning wide range of materials and surface treatments;
  • Flexible combination of diffusive and reflective light paths enable optimized performance for wide range of conditions;
  • Straight optic line enables image acquisition along the reflective light paths and the 90 degrees angle to the scanned surface;

Micro

Micro technology was developed specifically for optical inspection of IC Substrates at ultra high resolutions such as those used with Phoenix Nano and Micro models. Micro technology was designed to solve the following challenges:

  • Scanning at high resolution generates much larger amounts of data compared to regular inspection. Micro technology ensures the optimal split of calculations between hardware and software maximizing the data processing speed;
  • Micro algorithms are designed to detect defects that typically occur with extremely dense circuits and between narrow traces. Fine and shallow shorts is a particular challenge that Micro technology addresses with specifically designed sensors;
  • Ensuring structural and mechanical stability of the entire system is critical in high resolution inspection when even a slightest vibration can cause image distortion. Mechanical aspects of Micro technology centers around highly accurate systems components and elements;
  • Optical part of Micro technology consists of custom made high performance lens that ensures reliable image acquisition at high speeds and with all types of materials.

2D Metrology

2D metrology is CIMS technology for accurate measurements taken on the surface of a PCB. 2D metrology options are integrated with CIMS AOI systems becoming a part of inspection cycle, eliminating the need for a separate process.

AOI integrated 2D metrology options are designed to provide real time feedback to users becoming a powerful quality control tool in PCB production process.

CIMS offers two types of 2D metrology:

+2CD: real time micro-measurements of individual PCB elements, such as traces or pads, with up to ±3 micron accuracy (subject to surface condition). The measurements can be taken manually or automatically in pre-defined locations such as coupons or individual circuit elements.

+2DM: AOI integrated macro-measurements of an entire panel in order to determine any dimensions violation. This option is used to automatically calculate stretch factor by measuring distances between targets in each corner of a panel. The measurement can be taken manually or automatically after each scan.

3D Metrology

3D metrology is CIMS technology for accurate three dimensional measurements of individual elements of a PCB circuit. 3D metrology options can also be integrated with selected CIMS AOI systems providing a live control loop for the purposes of quality assurance.

CIMS 3D metrology technology has been adopted from Semiconductors industry and fit to serve specific needs of high end PCB and IC Substrates manufacturers.

CIMS offers two types of 3D metrology:

+3DH: real time 3D-measurements of a height or depth of individual PCB elements achieving up to ±2 micron accuracy (subject to surface condition of a measured element). The measurements can be taken manually or automatically in pre-defined locations such as coupons or individual circuit elements.

+3DP: real time 3D profiling of individual PCB elements with up to ±1 micron accuracy (subject to surface condition of a measured element). This option is commonly used for measuring depth of dimples resulting from plating over laser vias. +3DP allows users to detect quality problems related to a specific process and provide data necessary for corrective action.