AI-powered AOI verification station for IC Substrates with min line/space down to 4 µm.

AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 4μ is designed to support high volume manufacturing of IC Substrates and optimized for verification of 4 ~ 15 µm line/space width technology.

In AIVR mode, operator starts by reviewing defects’ images grabbed by AOI and processed with AI-based image enhancement algorithms enabling quick filtering out obvious false calls.

Using AIVR enables dramatic improvement in verification efficiency and speed while seamlessly integrating the results with the database. Moreover, users can easily classify defects using an optional touchscreen providing a critical feedback to QA in real time.

AIVR 4μ is compatible with all CIMS AOI.

AI-powered AOI verification station for IC Substrates with min line/space down to 5 µm.

AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 5μ is designed to support high volume manufacturing of IC Substrates and optimized for verification of 5 ~ 25 µm line/space width technology.

In AIVR mode, operator starts by reviewing defects’ images grabbed by AOI and processed with AI-based image enhancement algorithms enabling quick filtering out obvious false calls.

Using AIVR enables dramatic improvement in verification efficiency and speed while seamlessly integrating the results with the database. Moreover, users can easily classify defects using an optional touchscreen providing a critical feedback to QA in real time.

AIVR 5μ is compatible with all CIMS AOI.

AI-powered AOI verification station for HDI and IC Substrates with min line/space down to 10 µm.

AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 10μ is designed to support high volume manufacturing of HDI and IC Substrates and optimized for verification of 10 ~ 25 µm line/space width technology.

In AIVR mode, operator starts by reviewing defects’ images grabbed by AOI and processed with AI-based image enhancement algorithms enabling quick filtering out obvious false calls.

Using AIVR enables dramatic improvement in verification efficiency and speed while seamlessly integrating the results with the database. Moreover, users can easily classify defects using an optional touchscreen providing a critical feedback to QA in real time.

AIVR 10μ is compatible with all CIMS AOI.

AI-powered AOI verification station for HDI and IC Substrates with min line/space down to 15 µm.

AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 15μ is designed to support high volume manufacturing of HDI and IC Substrates and optimized for verification of 15 ~ 100 µm line/space width technology.

In AIVR mode, operator starts by reviewing defects’ images grabbed by AOI and processed with AI-based image enhancement algorithms enabling quick filtering out obvious false calls.

Using AIVR enables dramatic improvement in verification efficiency and speed while seamlessly integrating the results with the database. Moreover, users can easily classify defects using an optional touchscreen providing a critical feedback to QA in real time.

AIVR 15μ is compatible with all CIMS AOI.

AI-powered AOI verification station for HDI and multi-layer PCB with min line/space down to 25 µm.

AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 25μ is designed to support high volume manufacturing of HDI and multi-layer PCB and optimized for verification of 25 ~ 100 µm line/space width technology.

In AIVR mode, operator starts by reviewing defects’ images grabbed by AOI and processed with AI-based image enhancement algorithms enabling quick filtering out obvious false calls.

Using AIVR enables dramatic improvement in verification efficiency and speed while seamlessly integrating the results with the database. Moreover, users can easily classify defects using an optional touchscreen providing a critical feedback to QA in real time.

AIVR 25μ is compatible with all CIMS AOI.

AI-powered AOI verification station for HDI and multi-layer PCB with min line/space down to 30 µm.

AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 30μ is designed to support high volume manufacturing of HDI and multi-layer PCB and optimized for verification of 30 ~ 100 µm line/space width technology.

In AIVR mode, operator starts by reviewing defects’ images grabbed by AOI and processed with AI-based image enhancement algorithms enabling quick filtering out obvious false calls.

Using AIVR enables dramatic improvement in verification efficiency and speed while seamlessly integrating the results with the database. Moreover, users can easily classify defects using an optional touchscreen providing a critical feedback to QA in real time.

AIVR 30μ is compatible with all CIMS AOI.

AI-powered AOI verification station for IC Substrates with min line/space down to 7 µm.

AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 7μ is designed to support high volume manufacturing of IC Substrates and optimized for verification of 7 ~ 25 µm line/space width technology.

In AIVR mode, operator starts by reviewing defects’ images grabbed by AOI and processed with AI-based image enhancement algorithms enabling quick filtering out obvious false calls.

Using AIVR enables dramatic improvement in verification efficiency and speed while seamlessly integrating the results with the database. Moreover, users can easily classify defects using an optional touchscreen providing a critical feedback to QA in real time.

AIVR 7μ is compatible with all CIMS AOI.

Hybrid-mode AOI verification station for MLB PCB with min line/space down to 25+ µm.

VVR, CIMS hybrid-mode verification station that combines virtual and physical verification within a single workstation. VVR for MLB is designed to support high volume manufacturing of MLB PCB. The systems within this series include the following models:

• VVR 25μ is optimized for verification of 25 µm line/space width technology
• VVR 30μ is optimized for verification of 30 µm line/space width technology

In VVR mode, operator starts by reviewing defects’ images grabbed by AOI and processed with advanced image enhancement algorithms enabling quick filtering out obvious false calls.

Using VVR enables dramatic improvement in verification efficiency and speed while seamlessly integrating the results with the database. Moreover, users can easily classify defects using an optional touchscreen providing a critical feedback to QA in real time.

VVR for MLB is compatible with all CIMS AOI.

AVI verification station for IC Substrates with min line/fingers down to 4 µm.

SVS 4μ, CIMS AVI verification station, powered by Sprint™, is designed for verification of IC Substrates strips scanned with AVI systems. It is optimized for verification of 4 ~ 8 µm line/fingers width technology.

The system’s state of the art illumination combines reflective/coaxial light channel with three separate diffusive channels to maximize contrast on gold surface as well as on solder mask. The optics design allows convenient marking of defects or scrapping defective units. Robust mechanics and powerful hardware ensure high throughput and efficiency.

SVS 4μ user friendly interface and superior ergonomics are designed for convenient and easy operation that requires only minimal training. It is also fully compatible with CDB™ and CDBIC™ – CIMS defects and scrapped units data management system.

SVS 4μ is compatible with all CIMS AVI systems as well as 3rd party laser marking machines.

AVI verification station for IC Substrates with min line/fingers down to 10 µm.

SVS 10µ, CIMS AVI verification station, powered by Sprint™, is designed for verification of IC Substrates strips scanned with AVI systems. It is optimized for verification of 10 ~ 18 µm line/fingers width technology.

The system’s state of the art illumination combines reflective/coaxial light channel with three separate diffusive channels to maximize contrast on gold surface as well as on solder mask. The optics design allows convenient marking of defects or scrapping defective units. Robust mechanics and powerful hardware ensure high throughput and efficiency.

SVS 10μ user friendly interface and superior ergonomics are designed for convenient and easy operation that requires only minimal training. It is also fully compatible with CDB™ and CDBIC™ – CIMS defects and scrapped units data management system.

SVS 10μ is compatible with all CIMS AVI systems as well as 3rd party laser marking machines.