Special Applications

Inspection solutions for special applications

Special Applications

Blind Laser Via Inspection

CIMS Phoenix LV

Phoenix LV series

Phoenix LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 15, 20, 25 and 30 μm.

 


Through Laser Via Inspection

CIMS Galaxy VIA

Galaxy VIA series

Galaxy VIA series represent the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 20, 25 and 30 μm.

 


Mechanical Drill Inspection

CIMS Phoenix MDI

Phoenix MDI

Phoenix MDI is designed for inspection of mechanical (through) drills and slots on HDI and multi-layer PCB. It is capable to scan mechanical drills down to 150 µm in diameter.


Plugged Via Holes (PVH) Inspection

Galaxy PVH

Galaxy PVH

Galaxy PVH is designed to inspect to plugged via holes that are typically filled with resin in high volume manufacturing of MLB and HDI PCB supporting inspection of PVH  down to 75 µm in diameter.


Touch Screen Inspection

CIMS Phoenix Touch

Phoenix Touch

Phoenix Touch is designed for inspection of conductors on touch screen panels. It is capable to scan down to 25 µm line/space width technology.


Large Panel Inspection

CIMS Phoenix LT

Phoenix LT

Phoenix LT is designed for inspection of large panel of up to 36″ x 42″ (914 mm x 1,067 mm). It is capable to scan down to 40 µm line/space width technology.


Ultra high-res glass mask inspection

CIMS Phoenix PT Micro

Phoenix PT/Micro

Phoenix PT/Micro, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 7 µm line/space width technology.


IC Substrates Panel Inspection

CIMS Phoenix Fi ICS

Phoenix Fi/ICS

Phoenix Fi/ICS is designed to support final inspection of IC Substrates and ultra fine line HDI. It is capable to scan down to 7 µm line/space width technology.


PCB Panel Final Inspection

CIMS Phoenix Fi PCB

Phoenix Fi/PCB

Phoenix Fi/PCB is designed to support final inspection of HDI and MLB PCB. It is capable to scan down to 15 µm line/space width technology.

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