Semiconductors Inspection and Metrology

Semiconductors Inspection and Metrology

CIMS inspection capabilities are applied to advanced packaging, Wafer-level fan-out and fan-out panel-level-package while using 2D and 3D metrology tools integrated with the inspection tool.


Automated optical inspection (AOI) is a crucial step for PCB manufacturers, during which inner and outer layers are carefully inspected to assure functionality and reliability resulting in high yield production.

CIMS offers wide range of AOI systems for all segments of PCB industry – from IC Substrates and HDI, flex and rigid flex to mainstream multi-layer boards. CIMS AOIs are helping our customers to dramatically increase yield of PCB manufacturing process as well as improve quality of the final product.

Metrology and add-on inspection options

CIMS add-on options are designed to further enhance inspection capabilities of AOI and AVI systems. Those options can be integrated with CIMS equipment offering a new layer of quality assurance for our customers.
CIMS add-on options include unique 2D and 3D metrology capabilities that can be integrated with AOI systems and allowing to perform advanced measurements during the normal inspection cycle. Other options enable integrating defects data collection, classification and reporting capabilities into verification stage of inspection process.

add-on options CIMS

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