PVH option is an add-on functionality for selected CIMS AOI models enabling inspection of plugged via holes down to 75 microns in diameter. This new system further extends CIMS line of products an options for drill inspection applications.

The process of plugging drills typically involves resin or other materials and is done on mechanical drills as well as laser via. CIMS PVH option extends AOI capabilities to inspecting both types of drills delivering reliable detection of all defects within such drills.

PVH option is the perfect solution for customers who are looking for reliable and accurate tool to control the depth of resin within each drill with sufficiently fast throughput to match high volume production.

3D metrology is CIMS technology for accurate three-dimensional measurements of individual elements of a PCB circuit. 3D metrology options can also be integrated with selected CIMS AOI systems providing a live control loop for the purposes of quality assurance.

CIMS offers two types of 3D metrology:

+3DH: real time 3D-measurements of a height or depth of individual PCB elements achieving up to ±2~3 microns accuracy (subject to surface condition of a measured element). The measurements can be taken manually or automatically in pre-defined locations such as coupons or individual circuit elements.

+3DP: real time 3D profiling of individual PCB elements with up to ±1~2 microns accuracy (subject to surface condition of a measured element). This option is commonly used for measuring depth of dimples resulting from plating over laser vias. +3DP allows users to detect quality problems related to a specific process and provide data necessary for corrective action.

2D metrology is CIMS technology for accurate measurements taken on the surface of a PCB. 2D metrology options are integrated with CIMS AOI systems becoming a part of inspection cycle, eliminating the need for a separate process.

CIMS offers two types of 2D metrology:

+2CD: real time micro-measurements of individual PCB elements, such as traces or pads, with up to ±3~5 microns accuracy (subject to surface condition). The measurements can be taken manually or automatically in pre-defined locations such as coupons or individual circuit elements.

+2DM: AOI integrated macro-measurements of an entire panel in order to determine any dimensions violation. This option is used to automatically calculate stretch factor by measuring distances between targets in each corner of a panel. The measurement can be taken manually or automatically after each scan.

CIMS LDI is a laser drill inspection option designed for HDI PCB and IC Substrates. It is supplied as an add-on option suitable for all CIMS Phoenix family AOI models capable of inspecting laser drills of all sizes (subject to base system’s resolution).

LDI option works with both Microlight™ and Prisma™ illumination technologies utilizing special algorithms and logic optimized for detection of defects that typically occur in laser drills (laser vias). AOI systems equipped with LDI are capable of scanning both pre- and post-plating laser vias as well as conformal masks. Each such application features its own dedicated user interface making a job setup intuitive and straight forward.

LDI option adds a new level of versatility to Phoenix AOI systems enhancing their inspection capabilities to more applications and PCB manufacturing process stages.

Fi (Final Inspection) option allows inspecting of finished boards with CIMS AOI. It is supplied as an add-on option suitable for all CIMS Phoenix family AOI models extending their capabilities to final inspection.

Fi can reliably detect common defects on gold, copper and solder mask. The setup is easy and intuitive: operator chooses proper solder and silk layers, then the software takes care of combining them and generating high resolution reference which will be compared to the scanned image. Systems equipped with Fi option feature a dedicated final inspection interface for parameters setup.

Fi option adds a new level of versatility to Phoenix AOI systems enhancing their inspection capabilities to more applications and PCB manufacturing process stages.