3D metrology is CIMS technology for accurate three-dimensional measurements of individual elements of a PCB circuit. 3D metrology options can also be integrated with selected CIMS AOI systems providing a live control loop for the purposes of quality assurance.

CIMS offers two types of 3D metrology:

+3DH: real time 3D-measurements of a height or depth of individual PCB elements achieving up to ±2~3 microns accuracy (subject to surface condition of a measured element). The measurements can be taken manually or automatically in pre-defined locations such as coupons or individual circuit elements.

+3DP: real time 3D profiling of individual PCB elements with up to ±1~2 microns accuracy (subject to surface condition of a measured element). This option is commonly used for measuring depth of dimples resulting from plating over laser vias. +3DP allows users to detect quality problems related to a specific process and provide data necessary for corrective action.


  • Integration with CIMS AOI systems
  • Eliminates external measurement process
  • Fast and reliable
  • Provides immediate feedback and live alerts
  • Data collection and output option
  • Pre-programmed offline


  • Each 3D option are supplied separate or as a bundle
  • Can be bundled with 2D measurement capabilities
  • CDB/CDBIC connectivity – defects classification and virtual defects mapping
  • Data output options

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