CIMS is proud to exhibit at HKPCA 2025 on December 3rd-5th, 2025 | Shenzhen, China
Visit us at Booth 5E01
HKPCA stands as one of China’s premier PCB exhibitions, specializing in the Southern China PCB cluster. This year, we’re excited to present breakthrough innovations and solutions that empower our customers’ success.
Featured Highlights:
• Quantum AOI
Our revolutionary new product line delivers ultra-high-resolution inspection for advanced IC substrates. This groundbreaking system represents a major advancement in meeting the evolving demands of industry-leading fabricators, opening new possibilities and applications.
• Ucamco Software Suite
Discover next-generation frontend software solutions from CIMS subsidiary Ucamco, including:
– Ucam Xpert (next-generation pre-CAM)
– Integr8tor Nexus (full CAM efficiency leader)
• Automation Solutions
Explore our cutting-edge material handling automation across all PCB industry segments, plus our recently launched advanced copper peeling process solution.
We look forward to meeting you at our booth and sharing how these innovations can drive your success!
Join us at Booth 5E01 – Let’s shape the future of PCB manufacturing together.
