Fan-out panel and wafer level packaging inspection

Fan-out panel and wafer level packaging inspection

Fan-out panel and wafer level packaging inspection

Wafer Level Packaging (WLP) Inspection

CIMS Evolution

Evolution XF

Evolution XF series is a high throughput inspection solution for wafer-level-packging products, specifically designed for fan-out and fan-in applications. It is powered by Blaze™ , CIMS latest generation detection engine for Semiconductor inspection equipment.


Panel Level Packaging (PLP) Inspection

Galaxy PLP

Galaxy PLP

Galaxy PLP is designed to inspect panel-level-packaged products at high throughput and with unpralleled accuracy featuring extensive detection capabilities for all types of defects. It is powered by Blaze™ , CIMS latest generation detection engine for Semiconductor inspection equipment.

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