Fan-out panel and wafer level packaging inspection
Fan-out panel and wafer level packaging inspection
Fan-out panel and wafer level packaging inspection
Wafer Level Packaging (WLP) Inspection
Evolution XF
Evolution XF series is a high throughput inspection solution for wafer-level-packaging products, specifically designed for fan-out and fan-in applications. It is powered by Blaze™ , CIMS latest generation detection engine for Semiconductor inspection equipment.
Panel Level Packaging (PLP) Inspection
Galaxy PLP
Galaxy PLP is designed to inspect panel-level-packaged products at high throughput and with unparalleled accuracy featuring extensive detection capabilities for all types of defects. It is powered by Blaze™ , CIMS latest generation detection engine for Semiconductor inspection equipment.