Galaxy TGV 30x – the ultimate solution for TGV inspection

We are excited to introduce CIMS’ latest solution for TGV (through glass via) inspection, an emerging segment in the advanced IC substrates market. The Galaxy TGV 30x is designed to inspect TGVs as small as 30 microns in diameter and features dual illumination along with our cutting-edge Spark 4.0 software. In addition to detecting all types of defects inside and outside of TGVs, the Galaxy TGV 30x also offers integrated metrology capabilities.

We will be showcasing this system at the upcoming CPCA show in Shanghai. Please, visit us to learn more!

If you can’t visit us next week, please reach out to your local sales representative for more information.