CIMS will be exhibiting at HKPCA 2024 in Shenzhen, China, from December 4th to 6th. We invite you to visit us at our booth, 5D01.
HKPCA is one of the largest PCB exhibitions in China, focusing on Southern China PCB cluster. This year, we’re excited to introduce Spark™ 4.0, our next-generation software inspection engine, featuring powerful new functionalities. Additionally, we’ll present our latest inspection solution designed for advanced IC substrates, capable of handling down to a 2-micron line/space.
We’re also thrilled to launch Ucamco’s (a CIMS group company) newest frontend software products, which include next-generation pre-CAM and full CAM solutions, along with advanced material handling automation for all PCB industry segments.
Stop by to discover our latest innovations!
