New Product Launch – Quantum.ai LV

CIMS Press Release

Introducing Quantum.ai LV: A Quantum Leap in Laser Via Inspection

Advanced packaging keeps pushing laser vias to smaller diameters. In FCCSP, FCBGA, SiP and other leading-edge applications, small vias still have to meet tight quality requirements in volume production.

Quantum.ai LV is our answer: a new AOI line built on the CIMS Quantum platform and dedicated to the smallest laser vias. It comes in three models, Quantum.ai LV 20x, 15x and 10x, covering vias down to 10 µm in diameter.

AI built in, from the first scan
Quantum.ai LV brings CIMS’ latest AI technologies directly into the scanning process

 

TrueColor.ai analyzes every image in full color, adding a new dimension to defect classification.
Blaze.ai applies intelligent, zone-based analysis to each call as it is detected.
ai.Inside runs on the AOI in real time, filtering out common false calls before they reach verification.
A clearer view of every via
Telecentric optics give a true, straight-down view of each via, from top edge to bottom pad. The stable Quantum platform, with its granite base and real-time LiveFocus™, keeps that view sharp throughout production.

A complete laser via family
Galaxy LV remains the proven, flexible choice for a broad range of laser via applications. Quantum.ai LV takes inspection to the cutting edge.

Meet Us at TPCA 2026

Want to learn more about Quantum.ai LV and how it can support your most advanced laser via production? Meet our team at the TPCA Show in Taipei.

📅 October 20–22, 2026
📍 CIMS Booth L-728
📌4F, Hall 1, Taipei Nangang Exhibition Center, Taiwan

We look forward to seeing you there.

Ask us for more information

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