b Description AOI for IC Substrates and ultra fine line HDI with min line/space down to 10 µm. Galaxy 10Cχ, CIMS latest generation of AOI system, equipped with color camera, is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It...
b Description AOI for IC Substrates and ultra fine line HDI with min line/space down to 10 µm. Galaxy 10χ, CIMS AOI system, is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width...
b Description AOI for IC Substrates and ultra fine line HDI with min line/space down to 10 µm. Phoenix Maxima, CIMS AOI system, is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space...
b Description AOI for inspection of flex and rigid-flex with min line/space down to 10 µm. Phoenix FLEX/Maxima, CIMS AOI system, is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 10 µm line/space width...
b Description AOI for inspection of FPC in roll-to-roll process with min line/space down to 10 µm. Phoenix R2R/Maxima, CIMS AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 10 µm line/space...
