Galaxy R2R 30μ

b Description AOI for inspection of FPC in roll-to-roll process with min line/space down to 30 µm. Galaxy R2R 30µ, CIMS latest generation of AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down...

Galaxy Flex 30μ

b Description AOI for inspection of flex and rigid-flex with min line/space down to 30 µm. Galaxy Flex 30μ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm...

Galaxy 30μ

b Description AOI for HDI and multi-layer PCB with min line/space down to 30 µm. Galaxy 30μ, CIMS AOI system, is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology. The system’s...

Phoenix HDI

b Description AOI for HDI and multi-layer PCB with min line/space down to 30 µm. Phoenix HDI, CIMS AOI system, is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology. The system’s...

Phoenix R2R/HDI

b Description AOI for inspection of FPC in roll-to-roll process with min line/space down to 30 µm. Phoenix R2R/HDI, CIMS AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space...