CIMS Press Release Unicorn 1800/Sharp – New ultra-high resolution AVI for advanced IC Substrates CIMS is introducing its most advanced AVI system capable of scanning IC Substrates products down to 4 micron line/space. Unicorn 1800/Sharp represents the leading edge of...
CIMS Press Release Best Moments of 2021 CIMS Annual Grand Ceremony As the year 2021 is behind us, we are now looking forward to another exciting adventure in the new year 2022. Here is the video from CIMS Chinese New Year celebration. Happy New Year! Ask us for more...
CIMS Press Release Galaxy PLP series – advanced AOI for panel level package inspection Galaxy PLP series series is the latest advanced AOI line up from CIMS dedicated to panel level package inspection (PLP) of IC Substrates that incorporate embedded IC (die) within...
CIMS will be exhibiting at TPCA 2021 in Shenzhen, China. Please, visit us between August 4th and 6th. TPCA China (formerly known as CTEX) is one of the three major PCB shows in China focusing on high end PCB manufacturing. This year, it will be taking place in...
CIMS Press Release Galaxy X series – CIMS next generation of high resolution AOI for IC Substrates and HDI Galaxy χ series AOI systems represents the next generation ultra-high resolution technology that is capable to scan line width of down to 4 µm. Galaxy χ series...
