CIMS Press Release Capricorn Cx series – advanced AVI solution with color image acquisition CIMS has launched its next generation of Capricorn based AVI solution for IC Substrates – Capricorn Cx series. This new product family features dual stage the original...
b Description AVI for IC Substrates with min line/space down to 15 µm. Capricorn 15x, CIMS latest generation multiple resolutions AVI system, is designed for final inspection of IC Substrates. It is capable to scan down to 15 µm line/space (3.8 μm optical pixel size)...
b Description AVI for IC Substrates with min line/space down to 10 µm. Capricorn 10x, CIMS latest generation multiple resolutions AVI system, is designed for final inspection of IC Substrates. It is capable to scan down to 10 µm line/space (2.9 μm optical pixel size)...
b Description AVI for IC Substrates with min line/space down to 8 µm. Capricorn 8x, CIMS latest generation AVI system, is designed for final inspection of high-end IC Substrates. It is capable to scan down to 8 µm line/space (2.2μm optical pixel size) width...
b Description AVI for IC Substrates with min line/space down to 4 µm. Unicorn 1800/Sharp, CIMS latest generation ultra-high resolutions AVI system, is designed for final inspection of IC Substrates. It is capable to scan down to 4 µm line/space (1 μm optical pixel...
b Description AOI for IC Substrates and ultra fine line HDI with min line/space down to 10 µm. Galaxy 10χ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down...
b Description AOI for IC Substrates with min line/space down to 7 µm. Galaxy 7χ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width technology. The system’s...
b Description AOI for IC Substrates with min line/space down to 5 µm. Galaxy 5χ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 5 µm line/space width technology. The system’s...
b Description AOI for IC Substrates with min line/space down to 4 µm. Galaxy 4χ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 4 µm line/space width technology. The system’s...
b Description AOI verification station for IC Substrates with min line/space down to 4 µm. VVR, CIMS verification station combines virtual and physical verification within a single workstation. VVR for ICS is designed to support high volume manufacturing of IC...
b Description AVI for IC Substrates with min line/space down to 8 µm. Unicorn 900/Sharp, CIMS multiple resolutions AVI system, is designed for final inspection of IC Substrates. It is capable to scan down to 8 µm line/space (2.5 μm optical pixel size) width...
b Description AVI for IC Substrates with min line/space down to 10 µm. Unicorn 600/Sharp, CIMS multiple resolutions AVI system, is designed for final inspection of IC Substrates. It is capable to scan down to 10 µm line/space (2.8 μm optical pixel size) width...
b Description AVI for IC Substrates with min line/space down to 15 µm. Unicorn 300/Sharp, CIMS multiple resolutions AVI system, is designed for final inspection of IC Substrates. It is capable to scan down to 15 µm line/space (3.8 μm optical pixel size) width...
b Description AVI for IC Substrates with min line/space down to 5 µm. Unicorn 1200/Sharp, CIMS AVI system, is designed for final inspection of IC Substrates. It is capable to scan down to 5 µm line/space (1.5 μm optical pixel size) width technology. Unicorn AVI...
b Description AOI verification station for IC Substrates with min line/space down to 4 µm. VVR ICS, CIMS verification station combines virtual and physical verification within a single workstation. It is designed to support high volume manufacturing of IC...
b Description AOI for IC Substrates with min line/space down to 4 µm. Phoenix Ultima, CIMS latest generation of AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 4 µm line/space width technology. The system’s...
b Description Panel final inspection for IC Substrates and ultra fine line HDI with min line/space down to 7 µm. Phoenix Fi/ICS, CIMS latest generation of AOI system, is designed to support final inspection of IC Substrates and ultra fine line HDI. It is capable to...
b Description AOI for IC Substrates with min line/space down to 5 µm. Phoenix Nano, CIMS AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 5 µm line/space width technology. The system’s state of the art...
b Description AOI for IC Substrates with min line/space down to 7 µm. Phoenix Micro, CIMS AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width technology. The system’s state of the art...
b Description AOI for IC Substrates and ultra fine line HDI with min line/space down to 10 µm. Phoenix Maxima, CIMS AOI system, is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space...
