New Product Launch

CIMS Press Release Galaxy PLP series – advanced AOI for panel level package inspection Galaxy PLP series series is the latest advanced AOI line up from CIMS dedicated to panel level package inspection (PLP) of IC Substrates that incorporate embedded IC (die) within...

Visit us in TPCA show 2021

CIMS will be exhibiting at TPCA 2021 in Shenzhen, China. Please, visit us between August 4th and 6th. TPCA China (formerly known as CTEX) is one of the three major PCB shows in China focusing on high end PCB manufacturing. This year, it will be taking place in...

New Product Launch

CIMS Press Release Galaxy X series – CIMS next generation of high resolution AOI for IC Substrates and HDI Galaxy χ series AOI systems represents the next generation ultra-high resolution technology that is capable to scan line width of down to 4 µm. Galaxy χ series...

Visit us in CPCA show 2021

CIMS will be exhibiting at CPCA 2021 in Shanghai, China. Please, visit us between July 7th and 9th. CPCA is one of the three major PCB shows in China that takes place in Shanghai. It is popular with Chinese and Taiwanese visitors but has a considerable attendance by...

Galaxy R2R 30μ

b Description AOI for inspection of FPC in roll-to-roll process with min line/space down to 30 µm. Galaxy R2R 30µ, CIMS latest generation of AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down...