b Description AOI systems for laser via inspection with min diameter down to 10 µm. Galaxy LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within...
b Description AOI system for plugged via holes (PVH) inspection with min diameter down to 75 µm. Galaxy PVH is designed to inspect plugged via holes that are typically filled with resin in high volume manufacturing of MLB and HDI PCB. The process of plugging...
b Description AOI systems for through laser via inspection with min diameter down to 20 µm. Galaxy VIA series represent the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates. The...
b Description AOI systems for laser via inspection with min diameter down to 15 µm. Phoenix LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within...
b Description AOI for laser via inspection with min diameter down to 15 µm. Phoenix LV+, CIMS latest generation of AOI system, is designed to support inspection of laser via in high volume manufacturing of advanced HDI or IC Substrates. It is capable to scan via...
