b Description AOI verification station for MLB PCB with min line/space down to 25+ µm. VVR, CIMS verification station combines virtual and physical verification within a single workstation. VVR for MLB is designed to support high volume manufacturing of MLB PCB. The...
b Description AOI for IC Substrates with min line/space down to 4 µm. Galaxy 4Cχ, CIMS latest generation of AOI system, equipped with color camera, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 4 µm line/space width...
b Description AOI for IC Substrates with min line/space down to 5 µm. Galaxy 5Cχ, CIMS latest generation of AOI system, equipped with color camera, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 5 µm line/space width...
b Description AOI for IC Substrates with min line/space down to 7 µm. Galaxy 7Cχ, CIMS latest generation of AOI system, equipped with color camera, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width...
b Description AOI for IC Substrates and ultra fine line HDI with min line/space down to 10 µm. Galaxy 10Cχ, CIMS latest generation of AOI system, equipped with color camera, is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It...
CIMS Press Release CIMS AIVS – The Ultimate Virtual Verification Solution How would you like to be able to conduct verification of AOI detected defects at the fraction of time that it normally takes using standalone verification stations? Experience a revolutionary...
b Description AOI for inspection of FPC in roll-to-roll process with min line/space down to 30 µm. Galaxy R2R 30µ, CIMS latest generation of AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down...
b Description AOI for inspection of FPC in roll-to-roll process with min line/space down to 25 µm. Galaxy R2R 25µ, CIMS latest generation of AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down...
b Description AOI for inspection of FPC in roll-to-roll process with min line/space down to 15 µm. Galaxy R2R 15µ, CIMS latest generation of AOI system,is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down...
b Description AOI for inspection of flex and rigid-flex with min line/space down to 25 µm. Galaxy Flex 25μ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm...
b Description AOI for inspection of flex and rigid-flex with min line/space down to 30 µm. Galaxy Flex 30μ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm...
b Description AOI for inspection of flex and rigid-flex with min line/space down to 15 µm. Galaxy Flex 15μ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 15 µm...
b Description AOI for IC Substrates and ultra fine line HDI with min line/space down to 10 µm. Galaxy 10χ, CIMS AOI system, is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width...
b Description AOI for IC Substrates with min line/space down to 7 µm. Galaxy 7χ, CIMS AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width technology. The system’s state of the art optical...
b Description AOI for IC Substrates with min line/space down to 5 µm. Galaxy 5χ, CIMS AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 5 µm line/space width technology. The system’s state of the art optical...
b Description AOI systems for laser via inspection with min diameter down to 10 µm. Galaxy LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within...
b Description AOI for IC Substrates with min line/space down to 4 µm. Galaxy 4χ, CIMS AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 4 µm line/space width technology. The system’s state of the art optical...
b Description AOI for HDI and multi-layer PCB with min line/space down to 30 µm. Galaxy 30μ, CIMS AOI system, is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology. The system’s...
b Description AOI for HDI and multi-layer PCB with min line/space down to 25 µm. Galaxy 25μ, CIMS AOI system, is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan down to 25 µm line/space width technology. The...
b Description AOI for HDI and fine line PCB with min line/space down to 15 µm. Galaxy 15μ, CIMS AOI system, is designed to support high volume manufacturing of advanced HDI and fine line PCB. It is capable to scan down to 15 µm line/space width technology. The...
