b Description AI-powered AOI verification station for IC Substrates with min line/space down to 4 µm. AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 4μ is designed to support high volume...
b Description AI-powered AOI verification station for IC Substrates with min line/space down to 5 µm. AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 5μ is designed to support high volume...
b Description AI-powered AOI verification station for HDI and IC Substrates with min line/space down to 10 µm. AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 10μ is designed to support high...
b Description AI-powered AOI verification station for IC Substrates with min line/space down to 7 µm. AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 7μ is designed to support high volume...
b Description AI-powered AOI verification station for HDI and IC Substrates with min line/space down to 15 µm. AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 15μ is designed to support high...
b Description AI-powered AOI verification station for HDI and multi-layer PCB with min line/space down to 25 µm. AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 25μ is designed to support...
b Description AI-powered AOI verification station for HDI and multi-layer PCB with min line/space down to 30 µm. AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 30μ is designed to support...
b Description Hybrid-mode AOI verification station for MLB PCB with min line/space down to 25+ µm. VVR, CIMS hybrid-mode verification station that combines virtual and physical verification within a single workstation. VVR for MLB is designed to support high volume...
b Description AOI for IC Substrates with min line/space down to 4 µm. Galaxy 4Cχ, CIMS latest generation of AOI system, equipped with color camera, is designed to support high volume manufacturing of next generation IC Substrates. It is capable to scan down to 4 µm...
b Description AOI for IC Substrates with min line/space down to 5 µm. Galaxy 5Cχ, CIMS latest generation of AOI system, equipped with color camera, is designed to support high volume manufacturing of highly advanced IC Substrates. It is capable to scan down to 5 µm...
b Description AOI for IC Substrates with min line/space down to 7 µm. Galaxy 7Cχ, CIMS latest generation of AOI system, equipped with color camera, is designed to support high volume manufacturing of advanced IC Substrates. It is capable to scan down to 7 µm...
b Description AOI for IC Substrates and ultra fine line HDI with min line/space down to 10 µm. Galaxy 10Cχ, CIMS latest generation of AOI system, equipped with color camera, is designed to support high volume manufacturing of advanced IC Substrates and ultra fine line...
b Description AOI for inspection of FPC in roll-to-roll process with min line/space down to 30 µm. Galaxy R2R 30µ, CIMS AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width...
b Description AOI for inspection of FPC in roll-to-roll process with min line/space down to 25 µm. Galaxy R2R 25µ, CIMS AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm line/space width...
b Description AOI for inspection of FPC in roll-to-roll process with min line/space down to 15 µm. Galaxy R2R 15µ, CIMS AOI system,is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width...
b Description AOI for inspection of flex and rigid-flex with min line/space down to 25 µm. Galaxy Flex 25μ, CIMS AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm line/space width technology....
b Description AOI for inspection of flex and rigid-flex with min line/space down to 30 µm. Galaxy Flex 30μ, CIMS AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width technology....
b Description AOI for inspection of flex and rigid-flex with min line/space down to 15 µm. Galaxy Flex 15μ, CIMS AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology....
b Description AOI systems for laser via inspection with min diameter down to 10 µm. Galaxy LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this...
b Description AOI for HDI and multi-layer PCB with min line/space down to 30 µm. Galaxy 30μ, CIMS AOI system, is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology. The system’s...
