New Product Launch

CIMS Press Release CIMS AIVS – The Ultimate Virtual Verification Solution How would you like to be able to conduct verification of AOI detected defects at the fraction of time that it normally takes using standalone verification stations? Experience a revolutionary...

Galaxy R2R 30μ

b Description AOI for inspection of FPC in roll-to-roll process with min line/space down to 30 µm. Galaxy R2R 30µ, CIMS latest generation of AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down...

Galaxy R2R 25μ

b Description AOI for inspection of FPC in roll-to-roll process with min line/space down to 25 µm. Galaxy R2R 25µ, CIMS latest generation of AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down...

Galaxy R2R 15μ

b Description AOI for inspection of FPC in roll-to-roll process with min line/space down to 15 µm. Galaxy R2R 15µ, CIMS latest generation of AOI system,is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down...

Galaxy Flex 25μ

b Description AOI for inspection of flex and rigid-flex with min line/space down to 25 µm. Galaxy Flex 25μ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm...

Galaxy Flex 30μ

b Description AOI for inspection of flex and rigid-flex with min line/space down to 30 µm. Galaxy Flex 30μ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm...

Galaxy Flex 15μ

b Description AOI for inspection of flex and rigid-flex with min line/space down to 15 µm. Galaxy Flex 15μ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 15 µm...

Galaxy 10χ

b Description AOI for IC Substrates and ultra fine line HDI with min line/space down to 10 µm. Galaxy 10χ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down...

Galaxy 7χ

b Description AOI for IC Substrates with min line/space down to 7 µm. Galaxy 7χ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width technology. The system’s...

Galaxy 5χ

b Description AOI for IC Substrates with min line/space down to 5 µm. Galaxy 5χ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 5 µm line/space width technology. The system’s...

Galaxy LV series

b Description AOI systems for laser via inspection with min diameter down to 10 µm. Galaxy LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within...

Galaxy 4χ

b Description AOI for IC Substrates with min line/space down to 4 µm. Galaxy 4χ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 4 µm line/space width technology. The system’s...

Galaxy 30μ

b Description AOI for HDI and multi-layer PCB with min line/space down to 30 µm. Galaxy 30μ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width...

Galaxy 25μ

b Description AOI for HDI and multi-layer PCB with min line/space down to 25 µm. Galaxy 25μ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan down to 25 µm line/space...

Galaxy 15μ

b Description AOI for HDI and fine line PCB with min line/space down to 15 µm. Galaxy 15μ, CIMS latest generation of AOI system, is designed to support high volume manufacturing of advanced HDI and fine line PCB. It is capable to scan down to 15 µm line/space...

VVR for ICS

b Description AOI verification station for IC Substrates with min line/space down to 4 µm. VVR, CIMS verification station combines virtual and physical verification within a single workstation. VVR for ICS is designed to support high volume manufacturing of IC...

VVR for HDI

b Description AOI verification station for HDI PCB with min line/space down to 15 µm. VVR, CIMS verification station combines virtual and physical verification within a single workstation. VVR for HDI is designed to support high volume manufacturing of HDI...

Galaxy PVH

b Description AOI system for plugged via holes (PVH) inspection with min diameter down to 75 µm. Galaxy PVH is designed to inspect plugged via holes that are typically filled with resin in high volume manufacturing of MLB and HDI PCB. The process of plugging...

Galaxy VIA series

b Description AOI systems for through laser via inspection with min diameter down to 20 µm. Galaxy VIA series represent the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates. The...

Phoenix LV series

b Description AOI systems for laser via inspection with min diameter down to 15 µm. Phoenix LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within...