b Description AOI verification station for IC Substrates with min line/space down to 4 µm. VVR, CIMS verification station combines virtual and physical verification within a single workstation. VVR for ICS is designed to support high volume manufacturing of IC...
b Description AOI verification station for HDI PCB with min line/space down to 15 µm. VVR, CIMS verification station combines virtual and physical verification within a single workstation. VVR for HDI is designed to support high volume manufacturing of HDI PCB. The...
b Description AOI system for plugged via holes (PVH) inspection with min diameter down to 75 µm. Galaxy PVH is designed to inspect plugged via holes that are typically filled with resin in high volume manufacturing of MLB and HDI PCB. The process of plugging...
b Description AOI systems for through laser via inspection with min diameter down to 20 µm. Galaxy VIA series represent the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates. The...
b Description AOI systems for laser via inspection with min diameter down to 15 µm. Phoenix LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within...
b Description AOI verification station for HDI and MLB PCB with min line/space down to 25 µm. VVR, CIMS verification station combines virtual and physical verification within a single workstation. It is designed to support high volume manufacturing of HDI and MLB...
b Description AOI for IC Substrates with min line/space down to 4 µm. Phoenix Ultima, CIMS latest generation of AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 4 µm line/space width technology. The system’s...
b Description AOI for laser via inspection with min diameter down to 15 µm. Phoenix LV+, CIMS latest generation of AOI system, is designed to support inspection of laser via in high volume manufacturing of advanced HDI or IC Substrates. It is capable to scan via...
b Description AOI for HDI and multi-layer PCB with min line/space down to 30 µm. Phoenix HDI, CIMS AOI system, is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology. The system’s...
b Description AOI for HDI and multi-layer PCB with min line/space down to 25 µm. Phoenix Turbo, CIMS AOI system, is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan down to 25 µm line/space width technology. The...
b Description AOI for HDI and fine line PCB with min line/space down to 15 µm. Phoenix Extra, CIMS AOI system, is designed to support high volume manufacturing of advanced HDI and fine line PCB. It is capable to scan down to 15 µm line/space width technology. The...
b Description AOI for laser via inspection with min diameter down to 30 µm. Phoenix LV, CIMS latest generation of AOI system, is designed to support inspection of laser via in high volume manufacturing of HDI or IC Substrates. It is capable to scan via holes down...
b Description AOI for IC Substrates with min line/space down to 5 µm. Phoenix Nano, CIMS AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 5 µm line/space width technology. The system’s state of the art...
b Description AOI for IC Substrates with min line/space down to 7 µm. Phoenix Micro, CIMS AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width technology. The system’s state of the art...
b Description AOI for IC Substrates and ultra fine line HDI with min line/space down to 10 µm. Phoenix Maxima, CIMS AOI system, is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space...
b Description AOI for multi-layer PCB with min line/space down to 50 µm. Nova 800, CIMS latest generation of AOI system, is designed to support high volume manufacturing of multi-layer PCB (mainstream MLB). It is optimized for 50+ µm line/space width technology....
b Description AOI for multi-layer PCB with min line/space down to 75 µm. Nova 600, CIMS latest generation of AOI system, is designed to support high volume manufacturing of multi-layer PCB (mainstream MLB). It is optimized for 75+ µm line/space width technology....
b Description AOI for large panel inspection with min line/space down to 40 µm. Phoenix LT, CIMS latest generation of AOI system, is designed for inspection of large panel of up to 36″ x 42″ (914 mm x 1,067 mm). It is capable to scan down to 40 µm...
b Description AOI for inspection of FPC in roll-to-roll process with min line/space down to 30 µm. Phoenix R2R/HDI, CIMS AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space...
b Description AOI for inspection of flex and rigid-flex with min line/space down to 30 µm. Phoenix FLEX/HDI, CIMS AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width technology....
