Galaxy 25μ

b Description AOI for HDI and multi-layer PCB with min line/space down to 25 µm. Galaxy 25μ, CIMS AOI system, is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan down to 25 µm line/space width technology. The...

Galaxy 15μ

b Description AOI for HDI and fine line PCB with min line/space down to 15 µm. Galaxy 15μ, CIMS AOI system, is designed to support high volume manufacturing of advanced HDI and fine line PCB. It is capable to scan down to 15 µm line/space width technology. The...

VVR for ICS

b Description Hybrid-mode AOI verification station for IC Substrates with min line/space down to 4 µm. VVR, CIMS hybrid-mode verification station that combines virtual and physical verification within a single workstation. VVR for ICS is designed to support high...

VVR for HDI

b Description Hybrid-mode AOI verification station for HDI PCB with min line/space down to 15 µm. VVR, CIMS hybrid-mode verification station that combines virtual and physical verification within a single workstation. VVR for HDI is designed to support high volume...

Galaxy PVH

b Description AOI system for plugged via holes (PVH) inspection with min diameter down to 75 µm. Galaxy PVH is designed to inspect plugged via holes that are typically filled with resin in high volume manufacturing of MLB and HDI PCB. The process of plugging drills...

Galaxy VIA series

b Description AOI systems for through laser via inspection with min diameter down to 20 µm. Galaxy VIA series represent the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems...

Phoenix LT

b Description AOI for large panel inspection with min line/space down to 40 µm. Phoenix LT, CIMS AOI system, is designed for inspection of large panel of up to 36″ x 42″ (914 mm x 1,067 mm). It is capable to scan down to 40 µm line/space width technology....

Phoenix MDI

b Description AOI for inspection of mechanical drills down to 150 µm in diameter. Phoenix MDI, CIMS AOI system, is designed for inspection of mechanical drills on HDI and multi-layer PCB. It is capable to scan mechanical drills down to 150 µm in diameter. The system’s...

Phoenix Touch

b Description AOI for inspection of touch screen panels down to 25 µm line/space width. Phoenix Touch, CIMS AOI system, is designed for inspection of conductors on touch screen panels. It is capable to scan down to 25 µm line/space width technology. The system’s state...

Phoenix PT/Micro

b Description AOI for ultra fine line photo-tools with min line/space down to 7 µm. Phoenix PT/Micro, CIMS AOI system, is designed to inspect ultra fine line photo-tools such as film artworks as well as glass mask. It is capable to scan down to 7 µm line/space width...

Phoenix PT+

b Description AOI for high-res photo-tools with min line/space down to 12.5 µm. Phoenix PT+, CIMS AOI system, is designed to inspect high-res photo-tools such as film artworks as well as glass mask. It is capable to scan down to 12.5 µm line/space width technology....

Phoenix PT

b Description AOI for HDI and MLB PCB photo-tools with min line/space down to 25 µm. Phoenix PT, CIMS AOI system, is designed to inspect photo-tools such as film artworks as well as glass mask. It is capable to scan down to 25 µm line/space width technology. Since...