VVR for MLB

b Description AOI verification station for MLB PCB with min line/space down to 25+ µm. VVR, CIMS verification station combines virtual and physical verification within a single workstation. VVR for MLB is designed to support high volume manufacturing of MLB PCB. The...

Galaxy Fi 10Cχ

b Description Panel final inspection for HDI and MLB PCB with min line/space down to 10 µm. Galaxy Fi 10Cχ, CIMS latest generation of AOI system, is designed to support final inspection of HDI and MLB PCB. It is capable to scan down to 15 µm line/space width...

Galaxy Fi 15Cμ

b Description Panel final inspection for HDI and MLB PCB with min line/space down to 15 µm. Galaxy Fi 15Cμ, is a panel based final inspection system for HDI and MLB PCB, equipped with color camera and is designed to scan down to 15 µm line/space width technology. The...

Galaxy LV series

b Description AOI systems for laser via inspection with min diameter down to 10 µm. Galaxy LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within...

Galaxy 30μ

b Description AOI for HDI and multi-layer PCB with min line/space down to 30 µm. Galaxy 30μ, CIMS AOI system, is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology. The system’s...

Galaxy 25μ

b Description AOI for HDI and multi-layer PCB with min line/space down to 25 µm. Galaxy 25μ, CIMS AOI system, is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan down to 25 µm line/space width technology. The...

Galaxy 15μ

b Description AOI for HDI and fine line PCB with min line/space down to 15 µm. Galaxy 15μ, CIMS AOI system, is designed to support high volume manufacturing of advanced HDI and fine line PCB. It is capable to scan down to 15 µm line/space width technology. The...

VVR for HDI

b Description AOI verification station for HDI PCB with min line/space down to 15 µm. VVR, CIMS verification station combines virtual and physical verification within a single workstation. VVR for HDI is designed to support high volume manufacturing of HDI PCB. The...

Galaxy PVH

b Description AOI system for plugged via holes (PVH) inspection with min diameter down to 75 µm. Galaxy PVH is designed to inspect plugged via holes that are typically filled with resin in high volume manufacturing of MLB and HDI PCB. The process of plugging...

Galaxy VIA series

b Description AOI systems for through laser via inspection with min diameter down to 20 µm. Galaxy VIA series represent the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates. The...

Phoenix LV series

b Description AOI systems for laser via inspection with min diameter down to 15 µm. Phoenix LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within...

VVR

b Description AOI verification station for HDI and MLB PCB with min line/space down to 25 µm. VVR, CIMS verification station combines virtual and physical verification within a single workstation. It is designed to support high volume manufacturing of HDI and MLB...

Phoenix Fi/PCB

b Description Panel final inspection for HDI and MLB PCB with min line/space down to 15 µm. Phoenix Fi/PCB, CIMS latest generation of AOI system, is designed to support final inspection of HDI and MLB PCB. It is capable to scan down to 15 µm line/space width...

Phoenix LV+

b Description AOI for laser via inspection with min diameter down to 15 µm. Phoenix LV+, CIMS latest generation of AOI system, is designed to support inspection of laser via in high volume manufacturing of advanced HDI or IC Substrates. It is capable to scan via...

Phoenix Turbo

b Description AOI for HDI and multi-layer PCB with min line/space down to 25 µm. Phoenix Turbo, CIMS AOI system, is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan down to 25 µm line/space width technology. The...

Phoenix Extra

b Description AOI for HDI and fine line PCB with min line/space down to 15 µm. Phoenix Extra, CIMS AOI system, is designed to support high volume manufacturing of advanced HDI and fine line PCB. It is capable to scan down to 15 µm line/space width technology. The...

Phoenix LV

b Description AOI for laser via inspection with min diameter down to 30 µm. Phoenix LV, CIMS latest generation of AOI system, is designed to support inspection of laser via in high volume manufacturing of HDI or IC Substrates. It is capable to scan via holes down...

Phoenix LT

b Description AOI for large panel inspection with min line/space down to 40 µm. Phoenix LT, CIMS latest generation of AOI system, is designed for inspection of large panel of up to 36″ x 42″ (914 mm x 1,067 mm). It is capable to scan down to 40 µm...

Phoenix MDI

b Description AOI for inspection of mechanical drills down to 150 µm in diameter. Phoenix MDI, CIMS latest generation of AOI system, is designed for inspection of mechanical drills on HDI and multi-layer PCB. It is capable to scan mechanical drills down to 150 µm in...

Phoenix PT+

b Description AOI for high-res photo-tools with min line/space down to 12.5 µm. Phoenix PT+, CIMS latest generation of AOI system, is designed to inspect high-res photo-tools such as film artworks as well as glass mask. It is capable to scan down to 12.5 µm...