Visit us in CPCA show 2023

CIMS will be exhibiting at CPCA 2023 in Shanghai, China. Please, visit us between March 22nd and 24th. CPCA is one of the three major PCB shows in China that takes place in Shanghai. This year we expect large attendance due to recent relaxation of travel restrictions...

Happy Chinese New Year

CIMS Press Release Happy Chinese New Year! Many blessings for you and your family in the year to come. Happy Chinese New Year of the Rabbit 2023! 新春快乐!૮ ˶• ༝ •˶ა Ask us for more information Name Email Address Message 1 + 8 =...

Visit us in IPC show 2023

CIMS will be exhibiting at IPC 2023 in San Diego, USA. Make sure to visit our booth on Jan.24 -Jan.26 IPC (APEX) is the largest annual PCB event in North America, attracting visitors from the United States, Canada, Europe, and Asia. As always, CIMS brings innovative...

CIMS 2022 Global Supplier Day

CIMS Press Release CIMS 2022 Global Supplier Day In the last two years, CIMS and our supplier partners have been facing many challenges, such as global COVID-19 and chip shortages, which is continuously affecting daily operation and delivery engagement. How to...

Capricorn Launch Ceremony

CIMS Press Release Capricorn launch ceremony Looking back at our Capricorn release celebration in December last year. Ask us for more information Name Email Address Message 1 + 9 =...

New Product Launch

CIMS Press Release Capricorn – the next generation AVI solution from CIMS CIMS is launching its next generation AVI solution for IC Substrates based on a brand new platform – Capricorn. The new system features dual stage and dual camera and is powered by the most...

Happy Chinese New Year

CIMS Press Release Happy Chinese New Year! Many blessings for you and your family in the year to come. Happy Chinese New Year of the Tiger 2022! 新年快乐! Ask us for more information Name Email Address Message 2 + 14 =...

New Product Launch

CIMS Press Release Unicorn 1800/Sharp – New ultra-high resolution AVI for advanced IC Substrates CIMS is introducing its most advanced AVI system capable of scanning IC Substrates products down to 4 micron line/space. Unicorn 1800/Sharp represents the leading edge of...

CIMS 2021 Annual Dinner

CIMS Press Release Best Moments of 2021 CIMS Annual Grand Ceremony As the year 2021 is behind us, we are now looking forward to another exciting adventure in the new year 2022. Here is the video from CIMS Chinese New Year celebration. Happy New Year! Ask us for more...

New Product Launch

CIMS Press Release Galaxy PLP series – advanced AOI for panel level package inspection Galaxy PLP series series is the latest advanced AOI line up from CIMS dedicated to panel level package inspection (PLP) of IC Substrates that incorporate embedded IC (die) within...