AOI

Automated Optical Inspection Systems (AOI)

IC Substrates: 4 - 15 micron line/space

Bare Board Inspection(Galaxy Cχ Family)

CIMS Phoenix Ultima

Galaxy 4Cχ

Galaxy 4Cχ is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 4 µm line/space width technology.

Galaxy 5Cχ

Galaxy 5Cχ is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 5 µm line/space width technology.

Galaxy 7Cχ

Galaxy 7Cχ is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width technology.

Galaxy 10Cχ

Galaxy 10Cχ is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width technology.

 


Bare Board Inspection(Galaxy Family)

CIMS Phoenix Ultima

Galaxy 4χ

Galaxy 4χ is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 4 µm line/space width technology.

Galaxy 5χ

Galaxy 5χ is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 5 µm line/space width technology.

Galaxy 7χ

Galaxy 7χ is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width technology.

Galaxy 10χ

Galaxy 10χ is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width technology.

 


Hybrid Verification Systems

CIMS VVS ICS

VVR for ICS

VVR, CIMS verification station that combines virtual and physical verification within a single workstation. VVR for ICS is designed to support high volume manufacturing of IC Substrates and optimized for verification of 4 ~ 15 µm line/space width technology.


AI-powered Hybrid Verification Systems

CIMS VVS ICS

AIVR 5μ

AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 5μ is designed to support high volume manufacturing of IC Substrates and optimized for verification of 5 ~ 25 µm line/space width technology.

AIVR 7μ

AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 7μ is designed to support high volume manufacturing of IC Substrates and optimized for verification of 7 ~ 25 µm line/space width technology.

AIVR 10μ

AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 10μ is designed to support high volume manufacturing of HDI and IC Substrates and optimized for verification of 10 ~ 25 µm line/space width technology.


Photo-tools inspection

CIMS Phoenix PT

Phoenix PT/Micro

Phoenix PT/Micro, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 7 µm line/space width technology.

Phoenix PT+

Phoenix PT+, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 12.5 µm line/space width technology.

HDI PCB: 15 - 30 micron line/space

Bare Board Inspection

CIMS Phoenix Ultima

Galaxy 15μ

Galaxy 15μ is designed to support high volume manufacturing of advanced HDI PCB and fine line PCB. It is capable to scan down to 15 µm line/space width technology.

Galaxy 25μ

Galaxy 25μ is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan down to 25 µm line/space width technology.

Galaxy 30μ

Galaxy 30μ is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology.

 


Hybrid Verification Systems

CIMS VVS HDI

VVR for HDI

VVR, CIMS verification station that combines virtual and physical verification within a single workstation. VVR for HDI is designed to support high volume manufacturing of HDI and IC Substrates and optimized for verification of 15 ~ 25 µm line/space width technology.


AI-powered Hybrid Verification Systems

CIMS VVS HDI

AIVR 15μ

AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 15μ is designed to support high volume manufacturing of HDI and IC Substrates and optimized for verification of 15 ~ 100 µm line/space width technology.

AIVR 25μ

AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation.AIVR 25μ is designed to support high volume manufacturing of HDI and multi-layer PCB and optimized for verification of 25 ~ 100 µm line/space width technology.

AIVR 30μ

AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 30μ is designed to support high volume manufacturing of HDI and multi-layer PCB and optimized for verification of 30 ~ 100 µm line/space width technology.


Photo-tools inspection

CIMS Phoenix PT+

Phoenix PT+

Phoenix PT+, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 12.5 µm line/space width technology.

Phoenix PT

Phoenix PT, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 25 µm line/space width technology.

MLB PCB: 30 - 100 micron line/space

Bare Board Inspection

CIMS NOVA 600

Galaxy 30μ

Galaxy 30μ is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology.


Hybrid Verification Systems

CIMS VVR

VVR for MLB

VVR, CIMS verification station that combines virtual and physical verification within a single workstation. VVR for MLB is optimized for verification of 25+ µm line/space width technology.


AI-powered Hybrid Verification Systems

CIMS VVR

AIVR 30μ

AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 30μ is designed to support high volume manufacturing of HDI and multi-layer PCB and optimized for verification of 30 ~ 100 µm line/space width technology.


Photo-tools inspection

CIMS Phoenix PT

Phoenix PT

Phoenix PT, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 25 µm line/space width technology.

Flex, Rigid Flex, R2R: 5 - 15 micron line/space

Flex and Rigid-Flex PCB Inspection

CIMS Galaxy Flex series

Galaxy Flex 15μ

Galaxy Flex 15μ is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.


R2R (Roll-to-Roll) PCB Inspection

CIMS Galaxy R2R series

Galaxy R2R 15μ

Galaxy R2R 15μ is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.

Flex, Rigid Flex, R2R: 15 - 30 micron line/space

Flex and Rigid-Flex PCB Inspection

CIMS Galaxy Flex series

Galaxy Flex 25μ

Galaxy Flex 25μ is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm line/space width technology.

Galaxy Flex 30μ

Galaxy Flex 30μ is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width technology.


R2R (Roll-to-Roll) PCB Inspection

CIMS Galaxy R2R series

Galaxy R2R 25μ

Galaxy R2R 25μ is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm line/space width technology.

Galaxy R2R 30μ

Galaxy R2R 30μ is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width technology.

Special Applications

Blind Laser Via Inspection

CIMS Galaxy LV series

Galaxy LV series

Galaxy LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 10, 15, 20 and 25 μm.


Through Laser Via Inspection

CIMS Galaxy VIA

Galaxy VIA series

Galaxy VIA series represent the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 20, 25 and 30 μm.


Mechanical Drill Inspection

CIMS Phoenix MDI

Phoenix MDI

Phoenix MDI is designed for inspection of mechanical (through) drills and slots on HDI and multi-layer PCB. It is capable to scan mechanical drills down to 150 µm in diameter.


Plugged Via Holes (PVH) Inspection

Galaxy PVH

Galaxy PVH

Galaxy PVH is designed to inspect to plugged via holes that are typically filled with resin in high volume manufacturing of MLB and HDI PCB supporting inspection of PVH down to 75 µm in diameter.


Touch Screen Inspection

CIMS Phoenix Touch

Phoenix Touch

Phoenix Touch is designed for inspection of conductors on touch screen panels. It is capable to scan down to 25 µm line/space width technology.


Large Panel Inspection

CIMS Phoenix LT

Phoenix LT

Phoenix LT is designed for inspection of large panel of up to 36″ x 42″ (914 mm x 1,067 mm). It is capable to scan down to 40 µm line/space width technology.

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