AOI
Automated Optical Inspection Systems (AOI)
IC Substrates: 4 - 15 micron line/space
Bare Board Inspection
Galaxy 4Cχ
Galaxy 4Cχ, equipped with color camera, is designed to support high volume manufacturing of next generation IC Substrates. It is capable to scan down to 4 µm line/space width technology.
Galaxy 5Cχ
Galaxy 5Cχ, equipped with color camera, is designed to support high volume manufacturing of highly advanced IC Substrates. It is capable to scan down to 5 µm line/space width technology.
Galaxy 7Cχ
Galaxy 7Cχ, equipped with color camera, is designed to support high volume manufacturing of advanced IC Substrates. It is capable to scan down to 7 µm line/space width technology.
Galaxy 10Cχ
Galaxy 10Cχ, equipped with color camera, is designed to support high volume manufacturing of advanced IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width technology.
Hybrid Verification Systems
VVR for ICS
VVR, CIMS verification station that combines virtual and physical verification within a single workstation. VVR for ICS is designed to support high volume manufacturing of IC Substrates and optimized for verification of 4 ~ 15 µm line/space width technology.
AI-powered Hybrid Verification Systems
AIVR 4μ
AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 4μ is designed to support high volume manufacturing of IC Substrates and optimized for verification of 4 ~ 15 µm line/space width technology.
AIVR 5μ
AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 5μ is designed to support high volume manufacturing of IC Substrates and optimized for verification of 5 ~ 25 µm line/space width technology.
AIVR 7μ
AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 7μ is designed to support high volume manufacturing of IC Substrates and optimized for verification of 7 ~ 25 µm line/space width technology.
AIVR 10μ
AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 10μ is designed to support high volume manufacturing of HDI and IC Substrates and optimized for verification of 10 ~ 25 µm line/space width technology.
Photo-tools inspection
Phoenix PT/Micro
Phoenix PT/Micro, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 7 µm line/space width technology.
Phoenix PT+
Phoenix PT+, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 12.5 µm line/space width technology.
HDI PCB: 15 - 30 micron line/space
Bare Board Inspection
Galaxy 15μ
Galaxy 15μ is designed to support high volume manufacturing of advanced HDI PCB and fine line PCB. It is capable to scan down to 15 µm line/space width technology.
Galaxy 25μ
Galaxy 25μ is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan down to 25 µm line/space width technology.
Galaxy 30μ
Galaxy 30μ is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology.
Hybrid Verification Systems
VVR for HDI
VVR, CIMS verification station that combines virtual and physical verification within a single workstation. VVR for HDI is designed to support high volume manufacturing of HDI and IC Substrates and optimized for verification of 15 ~ 25 µm line/space width technology.
AI-powered Hybrid Verification Systems
AIVR 15μ
AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 15μ is designed to support high volume manufacturing of HDI and IC Substrates and optimized for verification of 15 ~ 100 µm line/space width technology.
AIVR 25μ
AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 25μ is designed to support high volume manufacturing of HDI and multi-layer PCB and optimized for verification of 25 ~ 100 µm line/space width technology.
Photo-tools inspection
Phoenix PT+
Phoenix PT+, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 12.5 µm line/space width technology.
Phoenix PT
Phoenix PT, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 25 µm line/space width technology.
MLB PCB: 30 - 100 micron line/space
Bare Board Inspection
Galaxy 30μ
Galaxy 30μ is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology.
Hybrid Verification Systems
VVR for MLB
VVR, CIMS verification station that combines virtual and physical verification within a single workstation. VVR for MLB is optimized for verification of 25+ µm line/space width technology.
AI-powered Hybrid Verification Systems
AIVR 25μ
AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 25μ is designed to support high volume manufacturing of HDI and multi-layer PCB and optimized for verification of 25 ~ 100 µm line/space width technology.
AIVR 30μ
AIVR, CIMS AI-powered verification station that combines virtual and physical verification within a single workstation. AIVR 30μ is designed to support high volume manufacturing of HDI and multi-layer PCB and optimized for verification of 30 ~ 100 µm line/space width technology.
Photo-tools inspection
Phoenix PT
Phoenix PT, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 25 µm line/space width technology.
Flex, Rigid Flex, R2R: 15 - 25 micron line/space
Flex and Rigid-Flex PCB Inspection
Galaxy Flex 15μ
Galaxy Flex 15μ is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.
R2R (Roll-to-Roll) PCB Inspection
Galaxy R2R 15μ
Galaxy R2R 15μ is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.
Flex, Rigid Flex, R2R: 25 - 30 micron line/space
Flex and Rigid-Flex PCB Inspection
Galaxy Flex 25μ
Galaxy Flex 25μ is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm line/space width technology.
Galaxy Flex 30μ
Galaxy Flex 30μ is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width technology.
R2R (Roll-to-Roll) PCB Inspection
Galaxy R2R 25μ
Galaxy R2R 25μ is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm line/space width technology.
Galaxy R2R 30μ
Galaxy R2R 30μ is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width technology.
Special Applications
Blind Laser Via Inspection
Galaxy LV series
Galaxy LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 10, 15, 20 and 25 μm.
Through Laser Via Inspection
Galaxy VIA series
Galaxy VIA series represent the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 20, 25 and 30 μm.
Mechanical Drill Inspection
Phoenix MDI
Phoenix MDI is designed for inspection of mechanical (through) drills and slots on HDI and multi-layer PCB. It is capable to scan mechanical drills down to 150 µm in diameter.
Plugged Via Holes (PVH) Inspection
Galaxy PVH
Galaxy PVH is designed to inspect to plugged via holes that are typically filled with resin in high volume manufacturing of MLB and HDI PCB supporting inspection of PVH down to 75 µm in diameter.
Touch Screen Inspection
Phoenix Touch
Phoenix Touch is designed for inspection of conductors on touch screen panels. It is capable to scan down to 25 µm line/space width technology.
Large Panel Inspection
Phoenix LT
Phoenix LT is designed for inspection of large panel of up to 36″ x 42″ (914 mm x 1,067 mm). It is capable to scan down to 40 µm line/space width technology.