AOI

Automated Optical Inspection Systems (AOI)

IC Substrates: 4 - 15 micron line/space

Bare Board Inspection(Phoenix Family)

CIMS Phoenix Ultima

Phoenix Ultima

Phoenix Ultima is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 4 µm line/space width technology.

Phoenix Nano

Phoenix Nano is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 5 µm line/space width technology.

Phoenix Micro

Phoenix Micro is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width technology.

Phoenix Maxima

Phoenix Maxima is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width technology.

 


Bare Board Inspection(Galaxy Family)

CIMS Phoenix Ultima

Galaxy 4χ

Galaxy 4χ is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 4 µm line/space width technology.

Galaxy 5χ

Galaxy 5χ is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 5 µm line/space width technology.

Galaxy 7χ

Galaxy 7χ is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width technology.

Galaxy 10χ

Galaxy 10χ is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width technology.

 


Verification Systems

CIMS CVR 100 IC

CVR 100 IC

CVR 100 IC, CIMS verification station, is designed to support high volume manufacturing of IC Substrates. It is optimized for verification of 5 ~ 25 µm line/space width technology.

CVR 100 FL

CVR 100 FL, CIMS verification station, is designed to support high volume manufacturing of HDI and IC Substrates. It is optimized for verification of 10 ~ 30 µm line/space width technology.


Hybrid Verification Systems

CIMS VVS ICS

VVR for ICS

VVR, CIMS verification station that combines virtual and physical verification within a single workstation. VVR for ICS is optimized for verification of 4 ~ 15 µm line/space width technology.


Photo-tools inspection

CIMS Phoenix PT

Phoenix PT/Micro

Phoenix PT/Micro, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 7 µm line/space width technology.

Phoenix PT+

Phoenix PT+, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 12.5 µm line/space width technology.

HDI PCB: 15 - 30 micron line/space

Bare Board Inspection (Phoenix Family)

CIMS Phoenix Extra

Phoenix Extra

Phoenix Extra is designed to support high volume manufacturing of advanced HDI PCB and fine line PCB. It is capable to scan down to 15 µm line/space width technology.

Phoenix Turbo

Phoenix Turbo is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan down to 25 µm line/space width technology.

Phoenix HDI

Phoenix HDI is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology.

 


Bare Board Inspection(Galaxy Family)

CIMS Phoenix Ultima

Galaxy 15μ

Galaxy 15μ is designed to support high volume manufacturing of advanced HDI PCB and fine line PCB. It is capable to scan down to 15 µm line/space width technology.

Galaxy 25μ

Galaxy 25μ is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan down to 25 µm line/space width technology.

Galaxy 30μ

Galaxy 30μ is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology.

 


Verification Systems

CIMS CVR 100 FL

CVR 100 FL

CVR 100 FL, CIMS verification station, is designed to support high volume manufacturing of HDI and IC Substrates. It is optimized for verification of 10 ~ 30 µm line/space width technology

CVR 100

CVR 100, CIMS verification station, is designed to support high volume manufacturing of HDI and multi-layer PCB. It is optimized for verification of 25 ~ 100 µm line/space width technology.


Hybrid Verification Systems

CIMS VVS HDI

VVR for HDI

VVR, CIMS verification station that combines virtual and physical verification within a single workstation. VVR for HDI is optimized for verification of 15 ~ 30 µm line/space width technology.


Photo-tools inspection

CIMS Phoenix PT+

Phoenix PT+

Phoenix PT+, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 12.5 µm line/space width technology.

Phoenix PT

Phoenix PT, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 25 µm line/space width technology.

MLB PCB: 30 - 100 micron line/space

Bare Board Inspection

CIMS NOVA 600

Phoenix HDI

Phoenix HDI is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology.

Galaxy 30μ

Galaxy 30μ is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology.

Nova 800

Nova 800 is designed to support high volume manufacturing of multi-layer PCB (mainstream MLB). It is optimized for 50+ µm line/space width technology.

Nova 600

Nova 600 is designed to support high volume manufacturing of multi-layer PCB (mainstream MLB). It is optimized for 75+ µm line/space width technology.


Verification Systems

CIMS CVR 100

CVR 100

CVR 100, CIMS verification station, is designed to support high volume manufacturing of HDI and multi-layer PCB. It is optimized for verification of 25 ~ 100 µm line/space width technology.


Hybrid Verification Systems

CIMS VVR

VVR

VVR, CIMS verification station that combines virtual and physical verification within a single workstation. It is optimized for verification of 25+ µm line/space width technology.


Photo-tools inspection

CIMS Phoenix PT

Phoenix PT

Phoenix PT, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 25 µm line/space width technology.

Flex, Rigid Flex, R2R: 5 - 15 micron line/space

Flex and Rigid-Flex PCB Inspection

CIMS Phoenix FLEX Maxima

Phoenix FLEX/Maxima

Phoenix FLEX/Maxima is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 10 µm line/space width technology.

Phoenix FLEX/Extra

Phoenix FLEX/Extra is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.

Galaxy Flex 15μ

Galaxy Flex 15μ is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.


R2R (Roll-to-Roll) PCB Inspection

CIMS Phoenix R2R Maxima

Phoenix R2R/Maxima

Phoenix R2R/Maxima is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 10 µm line/space width technology.

Phoenix R2R/Extra

Phoenix R2R/Extra is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.

Galaxy R2R 15μ

Galaxy R2R 15μ is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.

Flex, Rigid Flex, R2R: 15 - 30 micron line/space

Flex and Rigid-Flex PCB Inspection

CIMS Phoenix FLEX Turbo

Phoenix FLEX/Turbo

Phoenix FLEX/Turbo is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm line/space width technology.

Phoenix FLEX/HDI

Phoenix FLEX/HDI is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width technology.

Galaxy Flex 25μ

Galaxy Flex 25μ is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm line/space width technology.

Galaxy Flex 30μ

Galaxy Flex 30μ is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width technology.

 


R2R (Roll-to-Roll) PCB Inspection

CIMS Phoenix R2R Turbo

Phoenix R2R/Turbo

Phoenix R2R/Turbo is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm line/space width technology.

Phoenix R2R/HDI

Phoenix R2R/HDI is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width technology.

Galaxy R2R 25μ

Galaxy R2R 25μ is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm line/space width technology.

Galaxy R2R 30μ

Galaxy R2R 30μ is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width technology.

Special Applications

Blind Laser Via Inspection

CIMS Phoenix LV

Phoenix LV series

Phoenix LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 15, 20, 25 and 30 μm.

Galaxy LV series

Galaxy LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 10, 15, 20 and 25 μm.


Through Laser Via Inspection

CIMS Galaxy VIA

Galaxy VIA series

Galaxy VIA series represent the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 20, 25 and 30 μm.


Mechanical Drill Inspection

CIMS Phoenix MDI

Phoenix MDI

Phoenix MDI is designed for inspection of mechanical (through) drills and slots on HDI and multi-layer PCB. It is capable to scan mechanical drills down to 150 µm in diameter.


Plugged Via Holes (PVH) Inspection

Galaxy PVH

Galaxy PVH

Galaxy PVH is designed to inspect to plugged via holes that are typically filled with resin in high volume manufacturing of MLB and HDI PCB supporting inspection of PVH down to 75 µm in diameter.


Touch Screen Inspection

CIMS Phoenix Touch

Phoenix Touch

Phoenix Touch is designed for inspection of conductors on touch screen panels. It is capable to scan down to 25 µm line/space width technology.


Large Panel Inspection

CIMS Phoenix LT

Phoenix LT

Phoenix LT is designed for inspection of large panel of up to 36″ x 42″ (914 mm x 1,067 mm). It is capable to scan down to 40 µm line/space width technology.

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