Galaxy Fi 10Cχ

b Description Panel final inspection for advanced IC Substrates and ultra fine line HDI with min line/space down to 10 µm. Galaxy Fi 10Cχ, CIMS latest panel based final inspection system, is designed to support final inspection of advanced IC Substrates and ultra fine...

Galaxy Fi 5Cχ

b Description Panel final inspection for highly advanced IC Substrates and ultra fine line HDI with min line/space down to 5 µm. Galaxy Fi 5Cχ, CIMS latest panel based final inspection system, is designed to support final inspection of highly advanced IC Substrates...

Galaxy Fi 7Cχ

b Description Panel final inspection for advanced IC Substrates and ultra fine line HDI with min line/space down to 7 µm. Galaxy Fi 7Cχ, CIMS latest panel based final inspection system, is designed to support final inspection of advanced IC Substrates and ultra fine...

Galaxy Fi 15Cμ

b Description Panel final inspection for standard IC Substrates, HDI and MLB PCB with min line/space down to 15 µm. Galaxy Fi 15Cμ, CIMS latest panel based final inspection system, is designed to support final inspection of standard IC Substrates, HDI and MLB PCB. It...

Galaxy LV series

b Description AOI systems for laser via inspection with min diameter down to 10 µm. Galaxy LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this...

Galaxy PVH

b Description AOI system for plugged via holes (PVH) inspection with min diameter down to 75 µm. Galaxy PVH is designed to inspect plugged via holes that are typically filled with resin in high volume manufacturing of MLB and HDI PCB. The process of plugging drills...

Galaxy VIA series

b Description AOI systems for through laser via inspection with min diameter down to 20 µm. Galaxy VIA series represent the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems...

Phoenix MDI

b Description AOI for inspection of mechanical drills down to 150 µm in diameter. Phoenix MDI, CIMS AOI system, is designed for inspection of mechanical drills on HDI and multi-layer PCB. It is capable to scan mechanical drills down to 150 µm in diameter. The system’s...

Phoenix Touch

b Description AOI for inspection of touch screen panels down to 25 µm line/space width. Phoenix Touch, CIMS AOI system, is designed for inspection of conductors on touch screen panels. It is capable to scan down to 25 µm line/space width technology. The system’s state...

Phoenix PT/Micro

b Description AOI for ultra fine line photo-tools with min line/space down to 7 µm. Phoenix PT/Micro, CIMS AOI system, is designed to inspect ultra fine line photo-tools such as film artworks as well as glass mask. It is capable to scan down to 7 µm line/space width...