Galaxy LV series

b Description AOI systems for laser via inspection with min diameter down to 10 µm. Galaxy LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within...

Galaxy PVH

b Description AOI system for plugged via holes (PVH) inspection with min diameter down to 75 µm. Galaxy PVH is designed to inspect plugged via holes that are typically filled with resin in high volume manufacturing of MLB and HDI PCB. The process of plugging...

Galaxy VIA series

b Description AOI systems for through laser via inspection with min diameter down to 20 µm. Galaxy VIA series represent the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates. The...

Phoenix LV series

b Description AOI systems for laser via inspection with min diameter down to 15 µm. Phoenix LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within...

Phoenix Fi/ICS

b Description Panel final inspection for IC Substrates and ultra fine line HDI with min line/space down to 7 µm. Phoenix Fi/ICS, CIMS latest generation of AOI system, is designed to support final inspection of IC Substrates and ultra fine line HDI. It is capable...

Phoenix Fi/PCB

b Description Panel final inspection for HDI and MLB PCB with min line/space down to 15 µm. Phoenix Fi/PCB, CIMS latest generation of AOI system, is designed to support final inspection of HDI and MLB PCB. It is capable to scan down to 15 µm line/space width...

Phoenix LV+

b Description AOI for laser via inspection with min diameter down to 15 µm. Phoenix LV+, CIMS latest generation of AOI system, is designed to support inspection of laser via in high volume manufacturing of advanced HDI or IC Substrates. It is capable to scan via...

Phoenix LV

b Description AOI for laser via inspection with min diameter down to 30 µm. Phoenix LV, CIMS latest generation of AOI system, is designed to support inspection of laser via in high volume manufacturing of HDI or IC Substrates. It is capable to scan via holes down...

Phoenix Fi/ICS

b Description Panel final inspection for IC Substrates and ultra fine line HDI with min line/space down to 7 µm. Phoenix Fi/ICS, CIMS latest generation of AOI system, is designed to support final inspection of IC Substrates and ultra fine line HDI. It is capable...

Phoenix MDI

b Description AOI for inspection of mechanical drills down to 150 µm in diameter. Phoenix MDI, CIMS latest generation of AOI system, is designed for inspection of mechanical drills on HDI and multi-layer PCB. It is capable to scan mechanical drills down to 150 µm in...

Phoenix Touch

b Description AOI for inspection of touch screen panels down to 25 µm line/space width. Phoenix Touch, CIMS AOI system, is designed for inspection of conductors on touch screen panels. It is capable to scan down to 25 µm line/space width technology. The system’s state...

Phoenix PT/Micro

b Description AOI for ultra fine line photo-tools with min line/space down to 7 µm. Phoenix PT/Micro, CIMS latest generation of AOI system, is designed to inspect ultra fine line photo-tools such as film artworks as well as glass mask. It is capable to scan down...