IC Substrates

IC Substrates inspection solutions

IC Substrates: 4 - 15 micron line/space

Bare Board Inspection(Phoenix Family)

CIMS Phoenix Ultima

Phoenix Ultima

Phoenix Ultima is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 4 µm line/space width technology.

Phoenix Nano

Phoenix Nano is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 5 µm line/space width technology.

Phoenix Micro

Phoenix Micro is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width technology.

Phoenix Maxima

Phoenix Maxima is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width technology.

 


Bare Board Inspection(Galaxy Family)

CIMS Phoenix Ultima

Galaxy 4χ

Galaxy 4χ is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 4 µm line/space width technology.

Galaxy 5χ

Galaxy 5χ is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 5 µm line/space width technology.

Galaxy 7χ

Galaxy 7χ is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width technology.

Galaxy 10χ

Galaxy 10χ is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width technology.

 


Verification Systems

CIMS CVR 100 IC

CVR 100 IC

CVR 100 IC, CIMS verification station, is designed to support high volume manufacturing of IC Substrates. It is optimized for verification of 5 ~ 25 µm line/space width technology.

CVR 100 FL

CVR 100 FL, CIMS verification station, is designed to support high volume manufacturing of HDI and IC Substrates. It is optimized for verification of 10 ~ 30 µm line/space width technology.


Hybrid Verification Systems

CIMS VVS ICS

VVR for ICS

VVR, CIMS verification station that combines virtual and physical verification within a single workstation. VVR for ICS is optimized for verification of 4 ~ 15 µm line/space width technology.


Photo-tools inspection

CIMS Phoenix PT

Phoenix PT/Micro

Phoenix PT/Micro, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 7 µm line/space width technology.

Phoenix PT+

Phoenix PT+, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 12.5 µm line/space width technology.

Flex, Rigid Flex, R2R: 5 - 15 micron line/space

Flex and Rigid-Flex PCB Inspection

(Phoenix Family)

CIMS Phoenix FLEX Maxima

Phoenix FLEX/Maxima

Phoenix FLEX/Maxima is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 10 µm line/space width technology.

Phoenix FLEX/Extra

Phoenix FLEX/Extra is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.


Flex and Rigid-Flex PCB Inspection

(Galaxy Family)

CIMS Galaxy Flex series

Galaxy Flex 15μ

Galaxy Flex 15μ is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.


R2R (Roll-to-Roll) PCB Inspection

(Phoenix Family)

CIMS Phoenix R2R Maxima

Phoenix R2R/Maxima

Phoenix R2R/Maxima is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 10 µm line/space width technology.

Phoenix R2R/Extra

Phoenix R2R/Extra is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.


R2R (Roll-to-Roll) PCB Inspection

(Galaxy Family)

CIMS Galaxy R2R series

Galaxy R2R 15μ

Galaxy R2R 15μ is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.

IC Substrates (strips): 4 - 10 micron line/space

 

IC Substrates Strips Inspection

(Unicorn Family)

CIMS Unicorn 900

Unicorn 1800/Sharp

Unicorn 1800/Sharp, CIMS AVI system, is designed for final inspection of ultra fine line IC Substrates. It is capable to scan down to 4 µm line/space width technology.

Unicorn 1200/Sharp

Unicorn 1200/Sharp, CIMS AVI system, is designed for final inspection of ultra fine line IC Substrates. It is capable to scan down to 5 µm line/space width technology.

Unicorn 900/Sharp

Unicorn 900/Sharp, CIMS AVI system, is designed for final inspection of fine line IC Substrates. It is capable to scan down to 8 µm line/space width technology.

 


IC Substrates Strips Inspection

(Capricorn Family)

CIMS Capricorn 8x

Capricorn 8x

Capricorn 8x, CIMS AVI system, is designed for final inspection of fine line IC Substrates. It is capable to scan down to 8 µm line/space width technology.

 


Verification Systems

CIMS PVS 1200

PVS 1200

PVS 1200, CIMS AVI verification station, is designed for verification of IC Substrates strips scanned with AVI systems. It is optimized for verification of 5 ~ 8 µm line/fingers width technology.

PVS 900

PVS 900, CIMS AVI verification station, is designed for verification of IC Substrates strips scanned with AVI systems. It is optimized for verification of 8 ~ 12 µm line/fingers width technology.

IC Substrates (strips): 10 - 15 micron line/space

 

IC Substrates Strips Inspection

(Unicorn Family)

CIMS Unicorn 600

Unicorn 600/Sharp

Unicorn 600/Sharp, CIMS AVI system, is designed for final inspection of advanced IC Substrates. It is capable to scan down to 10 µm line/space width technology.

Unicorn 300/Sharp

Unicorn 300/Sharp, CIMS AVI system, is designed for final inspection of mainstream IC Substrates. It is capable to scan down to 15 µm line/space width technology.


IC Substrates Strips Inspection

(Capricorn Family)

CIMS Capricorn 15x

Capricorn 10x

Capricorn 10x, CIMS AVI system, is designed for final inspection of fine line IC Substrates. It is capable to scan down to 10 µm line/space width technology.

Capricorn 15x

Capricorn 15x, CIMS AVI system, is designed for final inspection of mainstream IC Substrates. It is capable to scan down to 15 µm line/space width technology.

 


Verification Systems

CIMS PVS 200

PVS 800

PVS 800, CIMS AVI verification station, is designed for verification of IC Substrates strips scanned with AVI systems. It is optimized for verification of 10 ~ 18 µm line/fingers width technology.

PVS 200

PVS 200, CIMS AVI verification station, is designed for verification of IC Substrates strips scanned with AVI systems. It is optimized for verification of 15 ~ 25 µm line/fingers width technology.

IC Substrates (panels): 7 - 25 micron line/space

 

IC Substrates Panel Inspection

CIMS Phoenix Fi ICS

 

Phoenix Fi/ICS

Phoenix Fi/ICS is designed to support final inspection of IC Substrates and ultra fine line HDI. It is capable to scan down to 7 µm line/space width technology.


 

Verification Systems

CIMS CVR 100 Fi

 

CVR 100 Fi

CVR 100 Fi, CIMS verification station, is designed for verification of finished boards of high-end HDI and IC Substrates. It is optimized for verification of 10 ~ 30 µm line/space width technology.

Special Applications

Blind Laser Via Inspection

(Phoenix Family)

CIMS Phoenix LV

Phoenix LV series

Phoenix LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 15, 20, 25 and 30 μm.


Blind Laser Via Inspection

(Galaxy Family)

CIMS Galaxy LV series

Galaxy LV series

Galaxy LV series represent the family of models designed to support inspection of blind laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 10, 15, 20 and 25 μm.


Through Laser Via Inspection

CIMS Galaxy VIA

Galaxy VIA series

Galaxy VIA series represent the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates. The systems within this family include the models for via hole sizes of 20, 25 and 30 μm.

 


Mechanical Drill Inspection

CIMS Phoenix MDI

Phoenix MDI

Phoenix MDI is designed for inspection of mechanical (through) drills and slots on HDI and multi-layer PCB. It is capable to scan mechanical drills down to 150 µm in diameter.


IC Substrates Panel Inspection

CIMS Phoenix Fi ICS

Phoenix Fi/ICS

Phoenix Fi/ICS is designed to support final inspection of IC Substrates and ultra fine line HDI. It is capable to scan down to 7 µm line/space width technology.

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