AOI

Automated Optical Inspection Systems (AOI)

IC Substrates: 5 - 15 micron line/space

Bare Board Inspection

CIMS Phoenix R2R Maxima

Phoenix Nano

Phoenix Nano is designed to support high volume manufacturing of of IC Substrates. It is capable to scan down to 5 µm line/space width technology.

Phoenix Micro

Phoenix Micro is designed to support high volume manufacturing of of IC Substrates. It is capable to scan down to 7 µm line/space width technology.

Phoenix Maxima

Phoenix Maxima is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width technology.


Verification Systems

CIMS CVR-100 IC

CVR 100 IC

CVR-100 IC, CIMS verification station, is designed to support high volume manufacturing of IC Substrates. It is optimized for verification of 5 ~ 25 µm line/space width technology.

CVR 100 FL

CVR-100 FL, CIMS verification station, is designed to support high volume manufacturing of HDI and IC Substrates. It is optimized for verification of 10 ~ 30 µm line/space width technology.


Photo-tools inspection

CIMS Phoenix PT

Phoenix PT/Micro

Phoenix PT/Micro, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 7 µm line/space width technology.

Phoenix PT+

Phoenix PT+, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 15 µm line/space width technology.

HDI PCB: 15 - 30 micron line/space

Bare Board Inspection

Phoenix Extra CIMS

Phoenix Extra

Phoenix Extra is designed to support high volume manufacturing of advanced HDI PCB and fine line PCB. It is capable to scan down to 15 µm line/space width technology.

Phoenix Turbo

Phoenix Turbo is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan down to 25 µm line/space width technology.

Phoenix HDI

Phoenix HDI is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology.


Verification Systems

CIMS CVR-100 FL

CVR 100 FL

CVR-100 FL, CIMS verification station, is designed to support high volume manufacturing of HDI and IC Substrates. It is optimized for verification of 10 ~ 30 µm line/space width technology

CVR 100

CVR-100, CIMS verification station, is designed to support high volume manufacturing of HDI and multi-layer PCB. It is optimized for verification of 25 ~ 100 µm line/space width technology.


Photo-tools inspection

CIMS Phoenix PT

Phoenix PT+

Phoenix PT+, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 15 µm line/space width technology.

Phoenix PT

Phoenix PT, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 25 µm line/space width technology.

MLB PCB: 30 - 100 micron line/space

Bare Board Inspection

Nova 800 CIMS

Phoenix HDI

Phoenix HDI is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 µm line/space width technology.

Nova 800

Nova 800 is designed to support high volume manufacturing of multi-layer PCB (mainstream MLB). It is optimized for 50+ µm line/space width technology.

Nova 600

Nova 600 is designed to support high volume manufacturing of multi-layer PCB (mainstream MLB). It is optimized for 75+ µm line/space width technology.


Verification Systems

CIMS CVR-100

CVR 100

CVR-100, CIMS verification station, is designed to support high volume manufacturing of HDI and multi-layer PCB. It is optimized for verification of 25 ~ 100 µm line/space width technology.


Photo-tools inspection

CIMS Phoenix PT

Phoenix PT

Phoenix PT, CIMS photo-tools AOI system, is designed to inspect high-resolution film artworks and glass masks. It is capable to scan down to 25 µm line/space width technology.

Flex, Rigid Flex, R2R: 5 - 15 micron line/space

Flex and Rigid-Flex PCB Inspection

CIMS Flex Inspection

Phoenix FLEX/Maxima

Phoenix FLEX/Maxima is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 10 µm line/space width technology.

Phoenix FLEX/Extra

Phoenix FLEX/Extra is designed to support high volume manufacturing of fine line flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.


R2R (Roll-to-Roll) PCB Inspection

CIMS R2RInspection

Phoenix R2R/Maxima

Phoenix R2R/Maxima is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 10 µm line/space width technology.

Phoenix R2R/Extra

Phoenix R2R/Extra is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 15 µm line/space width technology.

Flex, Rigid Flex, R2R: 15 - 30 micron line/space

Flex and Rigid-Flex PCB Inspection

CIMS Flex Inspection

Phoenix FLEX/Turbo

Phoenix FLEX/Turbo is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm line/space width technology.

Phoenix FLEX/HDI

Phoenix FLEX/HDI is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width technology.


R2R (Roll-to-Roll) PCB Inspection

CIMS R2RInspection

Phoenix R2R/Turbo

Phoenix R2R/Turbo is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 25 µm line/space width technology.

Phoenix R2R/HDI

Phoenix R2R/HDI is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. It is capable to scan down to 30 µm line/space width technology.

Special Applications

 

Laser Via Inspection

CIMS Laser Via Inspection

Phoenix LV

Phoenix LV is designed to support inspection of laser via in high volume manufacturing of HDI or IC Substrates. It is capable to scan via holes down to 30 µm in diameter.


Mechanical Drill Inspection

CIMS mechanical drill inspection

Phoenix MDI

Phoenix MDI is designed for inspection of mechanical (through) drills and slots on HDI and multi-layer PCB. It is capable to scan mechanical drills down to 150 µm in diameter.


Touch Screen Inspection

CIMS touch screen inspection

Phoenix Touch

Phoenix Touch is designed for inspection of conductors on touch screen panels. It is capable to scan down to 25 µm line/space width technology.


Large Panel Inspection

CIMS large panel inspection

Phoenix LT

Phoenix LT is designed for inspection of large panel of up to 36″ x 42″ (914 mm x 1,067 mm). It is capable to scan down to 40 µm line/space width technology.

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